October, 2024 Continued from previous page


saturation occurs or a cold solder crack, a typical 3D AOI algo- rithm might fill it in using the algorithms. In products that require high reliability, this can be catastrophic.


3D THT Inspection With a single solution,


MIRTEC has solved both THT solder joint inspection problems that can occur with triangulation- based technologies. The technolo- gy is named Anti-Reflection Technology and the equipment that uses it is called ART. Both above issues are ultimately caused by the fixed angle between the projector and the sensor. An optical system configured with an additional measurement angle can avoid these issues. A typical 3D AOI consists of


a main camera with a top-down orientation and multiple projec- tors with fixed angles. For laser scanning systems, the projectors are replaced by one or two laser emitters, but the configuration is similar. Depending on the equip- ment, the position of the projec- tors and camera may be reversed, but the fact that there is essen- tially only one projector and cam- era angle remains the same. In the ART, the optical sys-


tem is composed of additional cameras with a different angle than the existing camera. Since the most standard and efficient form of existing optics is a moiré system with one top-down cam- era and four digital projectors, the ART is configured as a five- camera system. Those familiar with the tra-


ditional side camera option here will recognize the similarity to the ART in terms of structure. However, there is one very important difference between the cameras added in the ART compared to the optional side camera. The side camera in the ART has the capability to do a 3D inspection. The principle by which ART


solves reflection and occlusion is the same. In the case of light sat- uration due to reflections, a large amount of light reflected to the top camera means that less light is reflected in the other direction. By observing the projection


pattern from a different direction than the top-down camera, 3D measurements can be made nor- mally without suffering from light saturation. Therefore, by constructing 3D data from the patterns measured by the ART’s side camera and the patterns measured by the top-down cam- era, and then merging the two data sets, normal THT solder inspection is possible without artificial data fill-in or measure- ment errors. In the case of occlusion, it occurs because the light reflected


Continued on page 53 See at SMTAI, Booth 2825


www.us-tech.com Reliable 3D THT Solder Inspection...


Page 49


THT solder joint measurement.


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