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October, 2024
Deep Dive: What Flying Probe Testers Can Test Today
By Francesca Pinto, Content Creator — Electronic Test Product Specialist, SPEA I
n industries such as aerospace and med- ical, where high reliability is a must, small variations in electronic device per-
formance are unacceptable, therefore testing is increasingly becoming an essential ele- ment to uncover defects and ensure that end products meet the standards. Electronic boards cover multiple functions
and embed mixed-technology components, often in a compact design. Miniaturized and complex electronic boards mean highly popu- lated PCBAs, reduced accessibility and increased interconnections. The test strategy adopted by elec-
tronics manufacturers to date has inher- ent limitations that cannot meet the chal- lenges of today’s technology trends. Electronic boards are often tested using test equipment such as AOI and X-ray machines. While this equipment can effectively verify the quality of the manu- facturing process, it fails to provide com- plete test coverage for defect detection. Nowadays, the testing of circuit
boards demands high-accuracy test equipment that can quickly perform dif- ferent types of tests on each component to ensure 100 percent fault identifica- tion, and flexible testers that meet the
day-to-day requirements of testing a wide variety of products in a short time. From maximum probing speed and accu-
racy to extended test techniques and maxi- mum ease of use in the generation and execu- tion of test programs, SPEA flying probe testers are effective solutions to meet these demands.
High-Density Boards
Advances in technology require the miniaturization of electronic circuit boards
and components. This means highly populat- ed PCBs, reduced accessibility for testing probes, and increased interconnections. Unlike bed-of-nails-testers, flying probe testers can reliably probe micro-test pads and even solder pads without damaging the board or components. Testing high-density boards (greater
than 30 components per square centimeter) requires specific technologies that ensure secure probing while avoiding possible dam- age to PCB and components. These boards are highly populated by micro-SMDs (e.g. 01005 and 008004) and have no test pads.
Another situation in which it is not
possible to include dedicated test pads in the assembly layout is when the prod- uct includes RF circuitry, especially in a high-density layout since the presence of test pads would interfere with the RF functionalities. To test the board, it is necessary to contact directly on SMD solder pads, which have already reached a size of 0.25 x 0.125 mm (008004). The small size of the test points
requires a high-accuracy tester for the positioning of the probes, as well as a
Today’s flying probers can test high-density PCBs. Continued on next page
Introducing 2 new models of Sayaka PCB Depaneling Router
Stand-alone/In-line 34XJ model offers flexibility and advanced features
S fl
· Stand-alone or In-line selection
· Robot interface for robot communication · Traceability for managing routing date/status · Automatic router bit changer and confirm bit size · Improved tact time with fast travel
speed (Max 1000mm/sec)
Table-top 23S Model offers a small footprint for limited production space
bl t 23SM d l ff · Competitive price and short lead time e (New inventory arriving!)
· Easy Windows GUI software programming
· Reads QR codes & fiducial · MES interface and more
marks automatically features Easy Windows GUI software programming
See more information at Ask for a quote today!
21241 S. Western Ave. Suite 140 Torrance, CA 90501 Phone: (310) 540-7310 Fax: (310) 540-7930
See at SMTAI, Booth 2813
23785 Cabot Blvd. Suite 306
Hayward, CA 94545 Tel: 510-293-0580 Fax: 510-293-0940
Clean depaneling
Automation of PCB loading & unloading
1580 Boggs Rd. #900
Duluth, GA, 30096 Phone: (770) 446-3116 Fax: (770) 446-3118
· Upgraded dust-collection system
for high quality output · Cut precisely with high
repeatability (±0.01mm/10μm)
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