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tech.com
October, 2024
Nihon Superior Highlights Soldering Materials
OSAGE BEACH, MO — Nihon Superior Co. Ltd. is exhibiting its TempSave™ series of low- temperature soldering materials at SMTA International 2024. The company also will showcase LF-C2 P608 solder paste. The TempSave series has been designed to address the industry’s goals of reduced peak reflow temperature to reduce
halogen free, lead-free, low void- ing solder paste. The demand of the automotive industry for solder alloys that deliver long life in con- ditions of extreme thermal cycling has resulted in the development of alloys that are very hard. While these hard alloys are resistant to the plastic deforma- tion that drives failure in thermal cycling, the trade-off is that their
LF-C2 P608 solder paste. See at electronica, Hall B2, Booth 504
defects contributing to package warpage, reduce energy consump- tion during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 282°F (139°C) and can be used for wave soldering. TempSave B37 is a ductile hypo eutectic SnBi alloy and can be reflowed with a peak temperature of 374°F (190°C).
High bismuth containing alloys are known to be brittle and therefore poor in drop shock per- formance. However, TempSave B37 has outstanding drop per- formance, even dramatically out- performing SAC305. The halogen- free P610 flux medium is specifi- cally designed for Bi alloys. LF-C2 P608 is a completely
hardness means that they have a tendency to crack when exposed to the other stresses to which automotive electronics are sub- jected in service. Nihon Superior’s LF-C2 strikes a balance between these two requirements, deliver- ing long life in thermal cycling but with a compliance that means that it is resistant to cracking under other loading conditions. With a liquidus temperature of 415°F (213°C) it can be reflowed at a lower temperature than SAC305. Contact: Nihon Superior
USA, LLC, 1395 Hawk Island Drive, Osage Beach, MO 65065 573-280-2357 E-mail:
k.how-
ell@nihonsuperior.co.jp Web:
www.nihonsuperior.com
See at SMTAI, Booth 2850
www.jbctools.com See at SMTAI, Booth 2822 and electronica, Hall B1, Booth 507
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