Next Issue Focus: Assembly and Automation
Send news releases for:
IPC APEX, EDS, and EWPTE
VOLUME 39 - NUMBER 3 This Month’s Focus:
Test and Inspection
THE GLOBAL ELECTRONICS PUBLICATION March, 2024
StenTech Solves SMT Stencil and Tooling Challenges
PHOENIXVILLE, PA — In the rapidly changing world of electronics manufacturing, StenTech is at the forefront of designing and manufacturing qual- ity stencil and tooling products. With a history
MIRTEC launches its ART system. Special features begin on ...
Page 60 EM Services
Goepel's AXI helps improve PCB quality at Hekatron. EM services begin on ...
Page 18 EM Products
spanning more than two decades and strategic ac- quisitions, the company has emerged as a top North American SMT stencil, tooling and parts manufacturer.
President and CEO Brent Nolan has been a part of the industry for nearly 40 years and began by building printed circuit boards. Later, he co-founded a circuit board shop before venturing into stencils and tooling, in order to meet customers’ needs. “My background ranges from building PCBs, PCBAs, and extending to full box builds,” says Nolan “Essentially, I have worked in the SMT/semiconductor industry end-to-end.”
Local Supply Chain
StenTech’s strategy centers around establish- ing a local supply chain. With manufacturing spread across various states in the U.S., the compa- ny has 20 facilities in Canada, the U.S. and Mexi- co. According to Nolan, the primary goal is to offer local accessible service to ensure optimal turn- around times.
Brent Nolan, president and CEO, StenTech.
The company has more than 300 talented pro- Continued on page 8
Koh Young Transforms ADCO’s THT Inspection
By Brent Fischthal, Head of Global Marketing, Koh Young Technology
Europlacer shows ii-P7 screen printer in the UK. EM products begin on ...
Page 28 New Products
DULUTH, GA — Sometimes it takes an avid enthusiast and user to think freely and see extra po- tential in a piece of equipment. That is exactly what happened when the team at ADCO Circuits decided to use an AOI ma- chine from Koh Young to in- spect their through-hole (THT) solder joints.
EAO intros online product configurator. New products begin on ...
Page 76
As ADCO Circuits’ head of operations Kevin Barrett states, it began with a realiza- tion that “Our solderers were spending a lot of time doing inspections.” Barrett had looked for solutions in the market but hadn’t been able to find anyone with the remedy he needed. He then approached Koh Young and asked if they had an interest in working with ADCO to find a solution.
Koh Young not only had an interest, but had already begun to deliver algorithms and devel-
oped them for that process. Bar- rett was delighted by the re- sponse from Koh Young, who, “Once again, said ‘Hey, we’ll put a machine in your facility, and we will work with you’.”
Progress in Terahertz Technology
BELLINGHAM, WA — Working in the terahertz (THz) range of- fers unique opportunities in var- ious applications, including im- aging, telecommunications, and advanced sensing systems. How- ever, because of the unique prop- erties of electromagnetic waves in the 0.1 to 10 THz range, it has proven difficult to develop high- performance components that showcase the true potential of THz technology. Even the design of basic and essential elements like filters and absorbers re- mains a substantial challenge.
ADCO Circuits’ manufacturing fa- cility in Rochester Hills, Michigan.
Barrett adds, “they gave us direct names of contacts and they said as you move forward, you guys do what you want with the equipment, tell us what you need, and we’ll be there for you.” The outcome, as Barrett ex- plains, is that “As I stand here Continued on page 6
Rise of Metamaterials
Fortunately, the rise of meta- materials might lead to innova- tive ways to solve these issues. Thanks to advances in manufac- turing and processing technolo- gies, it is now possible to create two-dimensional (2D) patterned microstructures with unique elec-
Continued on page 6
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88
