Page 72
www.us -
tech.com The State of the Art in Flying Probe Test Continued from previous page
and the CAD data from the design to automatically generate a complete test program. In order to minimize the
setup times for prototype, pre- series, and production tests this process is streamlined to be fast and easy, and the optimized
management of the software allows the parallelization of dif- ferent types of tests, saving pre- cious operational time. It can also include a smart
analysis functionality that, using a set of algorithms based on the principles of artificial intelli- gence, further optimizes the test
The material matters in material handling
flow during execution, while keeping coverage objectives unchanged. Full compatibility with the
smart factory is now an essential requirement, and the software platform of an advanced flying probe system is able to provide smart integration with all aspects of the customer’s produc- tion processes (data collection, traceability, interaction with MES, repair operations). The platform can also
include onboard machine indus- trial management solutions for remote monitoring of current and voltage consumption, check- ing the status of the power net- work and temperature level, for the status of the light indicators, parameters useful to indicate the correct functioning of the test, and to provide information relat- ed to predictive maintenance in real time.
Seica’s Solution Seica’s PILOT VX is a flexi-
ble and configurable test system, with a set of technologically advanced tools and features,
capable of providing the test solu- tions required by the enormous diversity that characterizes to - day’s electronics. An extraordinarily powerful
resource, the system is usable in every phase of the product lifecy- cle.
Its ability to provide imme-
diate and extremely precise access to all test points, com- bined with a vast suite of hard- ware and software measurement tools, allows the testing and vali- dation of prototypes and pre- series quickly, without requiring operators to have in-depth and specific training on how to gener- ate and execute test programs. The PILOT VX has estab-
lished itself as a new benchmark in terms of speed and perform- ance, a fully automated test solu- tion that responds to the funda- mental concerns of electronic board manufacturers who want to optimize their investments. Contact: Seica, Inc., 110
Avco Road, Haverhill, MA 01835 % 603-890-6002 E-mail:
davidsigillo@seicausa.com Web:
www.seica-na.com r
Solder Formulation Continued from page 67
complex and solidification over a temperature range is not the only prerequisite for the occur- rence of hot-tearing. As predicted by traditional solidification mod- els, hot tearing has not been an issue for the TempSave B37 alloy.
With the optimal bismuth
level determined, the next step in the development of TempSave
Nihon Superior Attains Reliable Low-Temp
B37 was to fine-tune the mechanical properties of the tin and bismuth phases with further additions. The objective was to adjust the mechanical properties of those two phases until, when the solder was subjected to stress, they worked together to accommodate the resulting strain in a way that ensured maximum ductility.
The Outcome Ball shear testing identified
the levels of Sb, Cu and Ni that optimized the toughness of the joint between the Sn-37Bi solder ball and the copper substrate as measured by the
energy
absorbed during the test and that is the alloy that Nihon Superior have introduced to the market as TempSave B37. Extensive testing by an inde- pendent laboratory and commer- cial evaluations have confirmed that the TempSave B37 has lived up to the expectation created by the development process and offers the prospect of high-yield low-temperature reflow of large IC packages. Contact: Nihon Superior
USA, LLC, 1395 Hawk Island Drive, Osage Beach, MO 65065 % 573-280-2357 E-mail:
k.howell@
nihonsuperior.co.jp Web:
www.nihonsuperior.com r
March, 2024
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