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March, 2024 The Growing Strengths of 3D AOI By Olaf Szarlan, Marketing, Viscom AG
the world. The variety of high- tech products that must be inspected requires new and advanced inspection methods. Components are becoming smaller and are packed more densely on printed circuit boards. The finest hairline bridges between individual sol- der joints can cause shorts. AOI must deliver high res-
3
olution, reliable measurement accuracy, intuitive simplicity in operation, and swift handling of inspection objects. Uncompro - misingly good imaging and comprehensive networking of inspection data are just as important as the simplest pos- sible creation of inspection pro- grams. Depen ding on the prod- uct, a different inspection con- cept may be required. The tech- nologies used have become firmly established — yet they are still optimized at different points and adapted to special requirements.
Continual Improvement Inspecting various assem-
blies, both in small production
D AOI systems ensure the highest quality in electron- ics manufacturing all over
higher data transfer rates, faster 3D image acquisition without compromising quality, a significant depth of field catering to unusually high com- ponents or leveraging artificial intelligence for component recognition when setting up a new inspection program. Viscom AG has developed a
new 3D sensor module, the XMplus-II, which has eight angled cameras and one orthog- onal camera and is installed in its iS6059 PCB Inspection Plus 3D AOI system. The total amount of infor-
An important quality indicator in solder joint inspection is the minimal cross section (MCS) — the smallest distance between the base of the component and the surface of the meniscus.
batches and in very large quanti- ties with the largest possible throughput, requires an equally high level of efficiency. In this context, it is crucial to continual- ly enhance existing strengths. This involves implementing
more powerful camera chips, adopting the latest frame grab- ber technology, and improving the acceleration of the sensor head, among many other consid- erations. Visible improvements in line operations may include
mation obtained is up to 150 MP and a speed of 12.4 in.2 (80 cm2) per second can be achieved. The maximum or thog onal camera resolution is 10 µm/pixel. The heights on the assembly are determined precisely up to a maximum of 1.2 in. (30 mm) using fringe projection with a z- resolution of 0.5 µm. Between calibration ses-
sions, the system undergoes automatic self-checks, assessing factors such as contrast, gray values, and other critical param- eters. This ensures consistently precise and reproducible results. Continued on next page
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