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WIXOM, MI — RAMPF Group, Inc., offers contract manufactur- ing services for sealing, casting and bonding in the automotive, electronics, energy technology, household appliance, lighting, and medical technology industries. The company manufactures
custom-made formed in place gaskets (FIPG) and formed in place foam gaskets (FIPFG) made of polyurethane using speed-robotic CNC dispensing. The foam gaskets are applied di- rectly to the component, expand in situ, and bond very quickly, reducing cycle times and ensur-
www.us -
tech.com
ing efficient processing. RAMPF processes reactive,
thermally and electrically con- ductive polymers using its own premium mixing and dispensing systems, which ensure the pre- cise and fast processing of highly filled materials. The produced parts are reliably protected from contact, moisture, and damage, guaranteeing for the lasting, high-performance functioning of electronic assemblies. RAMPF processes multi-
component adhesives into pre- cisely reacting products for join- ing components. The components
can be pre-treated to improve ad- hesion. The high-precision joining process can be carried out manually or fully automated. Integrated curing-on-demand (COD) systems accelerate the curing process. When joining components
in a vacuum, products such as displays are applied without air
bubbles (optical bonding). Contact: RAMPF Holding
GmbH & Co. KG, Albstrasse 37,
72661 Grafenberg, Germany % +49-7123-9342-1045 Web:
www.rampf-group.com
Potting application for electronics.
Making Ovens Smarter
See you at APEX 2024 Booth # 1626
™
•
HARTING: Han Solutions for Easy Field Termination
ELGIN, IL — HARTING is pre- senting its Han® ORV3, a power connector for data centers offer- ing the perfect balance between standardization and the highest degree of flexibility. Complexity
March, 2024 Contract Sealing, Casting and Bonding from RAMPF
Han ORV3 power connector.
is reduced as is the total cost of ownership. With the Han ORV3, HART-
ING for the first time offers an OCP-compliant AC connector, which is also available as com- plete power shelf v3 rack cable as- semblies. Shallower rack systems enable a more compact design for the entire infrastructure. As a re- sult, data centers can significantly increase their productivity within a given footprint. HARTING’s so- lution thus supports the Open Compute Project’s goal of optimiz- ing efficiency in the construction and scaling of data centers. The Han ORV3 for rack sys-
tems strikes a balance between standardization requirements and the goal of achieving as much flexibility as possible in the configuration of cable assem- blies for different current and voltage levels. The Han ORV3 component
eliminates complexity, as it con- sists of only a few part numbers. This enables high availability and, in cases of rack unit fail- ures, low average repair times, thanks to the open ORV3 stan- dard. Total cost of ownership
Reflo flow Soldering | Curing Soldering | Curing || Wave Soldering | S
kicthermal.com 858.673.6050 e Soldering | Selectiv t e
sales@kicmail.com
(TCO) is sustainably reduced. Contact: HARTING, Inc.,
1370 Bowes Road, Elgin, IL 60123 % 877-741-1500 E-mail:
kathryn.baxter@
harting.com Web:
www.harting.com
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