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www.us -
tech.com How to Maximize Efficiency in
PCB Assembly through Advanced Data Analytics
By Miles Moreau, General Manager, KIC I
n the ever-evolving landscape of electronics manufacturing, achieving the delicate bal-
ance between quality and pro- ductivity is a constant challenge. For engineering and production managers, optimizing electronics manufacturing operations is not only about meeting production goals but also about excelling in terms of quality, throughput, equipment utilization, and sus- tainability.
Reflow Soldering Recipe Optimization
At the core of PCB assembly
lies the quest for flawless solder joints. A well-centered process en- sures that each component reach- es the ideal temperature profile during reflow, resulting in robust and reliable connections between components. Reflow oven recipe optimization is instrumental in maintaining this delicate balance, transforming soldering from an art into a science.
Algorithms and AI can be
employed through thermal analysis software to fine-tune the reflow oven settings based on the data. These algorithms con- sider various factors such as the
type of components, PCB design, and environmental conditions to create customized temperature profiles/recipes. In high-volume electronics manufacturing, time is of the
essence. Striking a balance be- tween maximizing throughput by reducing cycle time and pre- serving soldering integrity is a challenge that engineering and production managers face daily. Reflow oven recipe optimization empowers manufacturers to fine- tune their processes, adhering to necessary temperature specifica- tions of the reflow profile, while pushing production capabilities to their limits. To achieve this delicate bal-
A versatile reflow oven setup can handle a high mix of PCBs with minimal disruption.
ance, thermal analysis software and data analytics come into play once again. Data from the reflow profile, along with produc- tion schedules and demand fore- casts, are analyzed to determine the optimal cycle time for each PCB assembly. Algorithms then adjust the reflow oven settings to achieve the desired throughput without compromising solder joint quality. Precise control of tempera-
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March, 2024
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