March, 2024 Continued from previous page
As usual, a combination of 2D, 2.5D, and 3D approaches allows for flexible adapta- tion, enabling swift polarity checks in 2D when needed, and, for instance, ensuring precise assessment of component copla- narity through the utilization of 3D.
Top and Bottom Inspection Current trends in areas such as charg-
ing infrastructure, electric mobility and renewable energies are driving other excit- ing developments. With the increase in innovative solu-
tions in the field of power electronics, the need for high-precision, networked and fast quality inspection of the manufactured components is growing. Due to the high currents in
these applications, through-hole technology (THT) continues to be used. The nature of the products means that defects must be reli- ably detected on the top and bot- tom — embedded in advanced analysis functions, including effi- cient statistical process control. On the underside, it is essential to ensure, for example, no pin is missing, and a sufficient supply of solder. Also, components pressed in without soldering (press-fit) can be precisely inspected from below. One such application is the
precise measurement of pin lengths and output in profiles. Viscom has developed the new 3D AOI system, iS6059 Double- Sided Inspection, for these requirements, which can inspect assemblies from above and below without having to automatically turn the inspection objects. On the top, the machine reads writ- ten information (OCR) with high recognition reliability, while typ- ically checking the polarity as well as the presence and position of the components. Another field of effective
quality control covered by the iS6059 Double-Sided Inspection system involves various products with double-sided SMD assem- bly. These could be smart park- ing assistants for vehicles, for instance. The first assembled side
passes through the soldering process, is then turned over and must remain fully intact during a re-melting of the solder joints in the oven — all while the second side is soldered after its assem- bly. The iS6059 Double-Sided Inspection system then checks both sides. The system is equipped with two sensor heads that record color images and 3D height information on separate handling units. Simultaneous inspection
from above and below enables a particularly high throughput to be achieved with full optical inspection coverage. Selective, wave and reflow soldering can be controlled equally reliably. The latter can also be inspected when using pin-in-paste technology,
3D inspection of THT solder joints with exact output of height profiles.
www.us -
tech.com The Growing Strengths of 3D AOI
which allows the THT to be soldered simultaneously with the SMD components.
Solutions for Individual Requirements
Not only top and bottom inspection,
but also X-ray and optical technology can be combined in one system housing. A spe- cial feature from Viscom that has been tried and tested is the internationally award-winning combination of 3D AXI with 3D AOI in the X7056-II system, which utilizes sophisticated, fast handling to achieve complete yet compact quality control of standard assemblies.
Page 63
Another example is the optical wire Continued on page 65
CONNECTING THE FUTURE OF SOLDERING CONNECT SMART
SAFE
www.weller-tools.com/wxsmart
TOTAL PROCESS CONTROL
www.weller-tools.com/wxsmart
CONTROL
Apex Tool Group, LLC 1000 Lufkin Road Apex, NC 27539 Tel: +1 919 387 0099 Fax: +1 866 907 9706 ©2022, Apex Tool Group LLC
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