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March, 2024 The State of the Art in Flying Probe Test By Walter Gueli, Pre-Sales and Product Development, Seica E
lectronics manufacturers face a myriad of challenges when testing boards. Often there is a need to test densely
populated boards on both sides, with limited access to test points (or even no test points), with components to be programmed and also
and, in combination with their extensive range of test and measurement resources, they are able to provide a test solution to overcome these challenges, achieving 100% coverage.
Considering the level of today’s hard-
ware and software, flying probe technology should be seen holistically. Flexibility, excel- lent coverage, and test speed are three excel- lent reasons to shift to this testing philoso- phy, making it a strategic corporate invest- ment.
In addition, flying probe testing has the
enormous advantage of not requiring fix- tures, which means not having to prepare (and pay for) extra tooling or storage space.
Test Flexibility Testing both sides of a board at the same
time has virtually become a requirement. Flexibility is characterized primarily by hav- ing an adequate number of test probes to support the numerous functions that the sys- tem is equipped with, evenly distributed on both sides of the board (top and bottom), which is increasingly often positioned verti- cally.
The vertical positioning of the board has Vertical, double-sided testing.
particular ones, such as LEDs, which require both electrical and functional optical testing. The most advanced flying probers have achieved incredible mechanical performance
numerous advantages, including intrinsical- ly augmented stability during testing, and it allows the optimization of the physical archi- tecture of the system to achieve a space-sav- ing smaller footprint. The integration of the measurement
The pressure exerted by the probes on the test points.
precision and general performance. In addi- tion to traditional in-circuit tests, power-on functional tests, boundary scan and the onboard programming of components can also be performed. Test speed is as fundamental as the pre-
vious characteristics. A slow test bottlenecks the line. The flying probe tester does not require
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instruments directly on each test head enables fast test execution, elimination of electrical noise and increased measurement
SIMULATION OF THERMAL DISSIPATION ON PCB FOR POWER MODULES
REDEXPERT. Würth Elektronik’s online platform for simple component selection and performance simulation:
www.we-online.com/redexpert
• Simulation of Thermal Dissipation on PCB for Power Modules
• The world’s most accurate AC loss model • Filter settings for over 20 electrical and mechanical parameters
• Inductor simulation and selection for DC/DC converters • Available in seven languages • Online platform based on measured values • Ability to compare inductance/current and temperature rise/DC current using interactive measurement curves
• Order free samples directly • Direct access to product datasheets • Comfortable and clear component selection
WE meet @ APEC
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