Jan/Feb 2025
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Page 89 DPC and Advanced Medical Packaging Workshop Colocate
PITTSBURGH, PA — The 21st Annual Device Packaging Conference (DPC 2025) will be held March 3 tp 6, 2025, at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona. This esteemed event brings together industry engineers, researchers and top experts involved in advanced packaging and micro- electronics assembly with a multi-faceted technical program and unique networking events. This year's General Chair,
Amy Lujan with SavanSys, com- mented, "2025 will be an exciting year for Device Packaging. To kick off the conference's third decade, we're in a new location that gives us room to grow our exhibit hall and technical pro- gram. In addition to our popular tracks focused on 2D/3D hetero- geneous integration, flip chip, and fan-out/wafer-level packag- ing, there will be a greater focus on emerging technologies and applications that are driving advancements in packaging." The technical content
includes a concurrent four-track program and interactive poster session, with 116 speakers. Attendees will hear from keynote speakers from Absolics, IBM, and ScaleFlux. An evening panel dis- cussion is planned on "Preparing for the Coming AI Winter" and a business plenary session will focus on "Scaling of AI from Datacenter to Consumer." Attendees can also register
for 17 professional development courses that will be held on Monday, March 3. These focused courses provide a learning oppor- tunity for looking to enhance their skills and knowledge, or those new to the industry. A sold-out exhibit hall will
showcase the latest products, technologies, and applications. Registration includes networking opportunities that promote atten -
APEC 2025 to Host Student Job Fair
Continued from previous page
hand to conduct the interviews must also be registered to attend APEC 2025. "We see the importance and
value of providing this event as part of our APEC programs," said Alireza Safaee, APEC 2025 student job fair chair. "Student job fair company participants will meet with motivated stu- dents who will have questions about your current openings, company culture, and more." Contact: APEC c/o MMS
Meetings, 1201 New Jersey Avenue NW, Washington D.C. 20001 % 202-624-1765 E-mail:
apec@apec-conf.org Web:
www.apec-conf.org r
dee interaction: welcome and exhibit hall receptions, group lunches, poster session happy hour, and the second annual 3D InCites Back Yard Olympics fol- lowing the poster session. A post- conference golf scramble will be offered to raise funds for the IMAPS Microelectronics Foun - dation. On March 5 to 7, the
Advanced Packaging for Medical Microelectronics workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging
methods to enable the next gener- ation of medical microelectronic devices. It will draw invited experts in the fields of medicine, medical devices, biomaterials, microelectronics, semiconductor packaging, and product assembly and will cover topics involving technologies, products, strategies, current and emerging markets, and collaborations in areas such as Disease Detection, Materials, Assembly and Applications/ Products. The event will kick off with
a combined poster session (with DPC 2025) on March 5, followed
by the technical program on March 6 and 7. Three keynotes are scheduled: "Inspire: A Story of Growth" (Dave Dieken, Inspire Medical Systems), "RF Packaging and Integrated Antennas for Low- Cost Medical Radar Sensor Systems" (Ivan Ndip, Fraunhofer IZM/ Brandenburg Univ. of Technol ogy) and "The Economics of Small Medical Implants" (Rex Hales, Cirtec Medical). Contact: IMAPS, P.O. Box
14727, Pittsburgh, PA 15234 % 919-293-5000 E-mail:
info@imaps.org Web:
www.imaps.org r
MARCH 15-20 MARCH 18-20
MEETINGS + COURSES CONFERENCE + EXHIBITION 25TH ANNIVERSARY ANAHEIM CONVENTION CENTER / CA
REIMAGINE TH POSSIBILITIES
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BUNDLE AND SAVE 70% WITH OUR ALL-ACCESS PACKAGE!
• ALL technical conference sessions • ALL standards committee meetings
• ALL networking luncheons • ALL keynotes
DON’T MISS OUR EARLY-BIRD DISCOUNTS!
Register today and save big on group packages, accommodations, and transportation. Traveling from abroad? Start planning now to avoid visa delays.
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