Jan/Feb 2025


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Page 61 Beyond Reliability in Solder Pastes By Gayle Towell, AIM Solder


ensuring that electronic components hold together securely over time. However, the conversation around these pastes frequently centers almost exclu- sively on their reliability, overshadowing equally crucial performance metrics such as wetting, voiding, and printability. High reliability should be balanced with superior performance across all relevant dimensions.


H


Rework and Scrap When a paste excels in relia-


bility but falls short in other areas, it can lead to increased rework and higher scrap rates. The consequences are not merely technical but also economic. The necessity for rework —


correcting poor solder joints, bridging, or other defects — con- sumes valuable time and resources, significantly impact- ing production timelines and operational efficiency. The scrap rate, a direct measure of wasted materials, components, further inflates costs. The true cost of rework and


scrap also includes lost productiv- ity, delayed product deliveries, and, critically, a tarnished reputa- tion among customers expecting high-quality, reliable products. In sectors where the reliabil-


ity of electronic components is non-negotiable, such as aero- space, automotive, and medical devices, the stakes are even high- er. Here, the failure to meet stringent quality standards can have dire consequences, under- scoring the need for solder pastes that perform reliably across all metrics. The development of solder


pastes that meet these compre- hensive performance criteria requires a rigorous approach, one that simulates real-world manu- facturing environments as closely as possible. In recognition of this imperative, AIM Solder leverages its state-of-the-art applications lab to replicate the conditions under which its products will be applied. This hands-on, empirical method- ology ensures that products are not only theoretically sound but practically effective. By validating solder pastes


in settings that mimic actual pro- duction environments, manufac- turers can better understand how these materials will perform in the field. This approach also allows for the fine-tuning of paste formulations to address specific challenges such as reducing void- ing in complex assemblies, enhancing wetting on various substrates, and ensuring consis- tent printability across a wide range of stencil designs and processes.


REL22 thermal cycle test results vs. SAC305.


igh reliability solder pastes are implemented for their ability to withstand extreme conditions,


Case Study REL22™ is a high reliability alloy


developed to withstand the most extreme environments. And from its inception, REL22 was not just designed to provide high reliability but to address the broad- er spectrum of manufacturing chal- lenges. Its formulation reflects a balance between achieving minimal voiding, superior wetting, and excellent printabil- ity, alongside enduring mechanical strength, and thermal resilience.


REL22 distinguishes itself from other Continued on page 63


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