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Next Issue Focus:


Assembly and Automation


Send news releases for:


IPC APEX and APEC


VOLUME 40 - NUMBER 1 and Assembly


This Month’s Focus: Components


THE GLOBAL ELECTRONICS PUBLICATION Jan/Feb 2025


GÖPEL Launches All-Around Inspection in a Single Platform


AUSTIN, TX — The new Multi Line from GÖPEL electronic is a flexible platform that combines dif-


ferent inspection tasks such as SMD and THT in- spection, Solder Paste Inspection (SPI) and Confor- mal Coating Inspection (CCI). The centerpiece of this solution is a modular


Takaya boosts Microboard’s test accuracy with flying probe technology...


Page 54


Product Preview: MD&M West


base system with standardized, easy-to-use operat- ing software. The flexible all-around system can be configured with modules for AOI, SPI, and CCI, supporting all optical inspection tasks throughout the entire manufacturing process. Multi Line also offers additional, customer-specific configuration options, such as double-sided 3D inspection with- out turning the assembly. Standardized, award- winning software makes the systems easy to use, reducing effort and maximizing efficiency.


Flexible Transport For THT printed circuit board assemblies


Nikon launches new vision system series. Product Previews begin on ...


Page 66 EM Services


Multi Line offers combined inspection tasks in a single platform.


(PCBAs), Multi Line provides flexible transport op- tions, with or without carriers, and all the neces- sary camera modules for this application. It also al- lows THT solder inspection, even during return on the optional lower transport conveyor. Due to 3D technology, solder joints can be inspected not only


Continued on page 6


Precision Lasers at the Chip Scale


Axxon Mycronic evolves coating and dispensing. EM services begin on ...


Page 18 EM Products


SANTA BARBARA, CA — For ex- periments that require ultra-pre- cise measurements and control over atoms — think two-photon atomic clocks, cold-atom interfer- ometer sensors and quantum gates — lasers are the technology of choice, the more spectrally pure (emitting a single color/ frequency), the better. Conventional lab-scale laser technology currently achieves this ultra low- noise, stable light via bulky, costly tabletop sys- tems designed to gener- ate, harness and emit photons within a narrow spectral range. But what if these


Saki intros advanced


X-ray inspection system. EM products begin on ...


Page 34


the performance of these lasers on lightweight devices that can fit in the palm of the hand. “These smaller lasers will


enable scalable laser solutions for actual quantum systems, as well as lasers for portable, field- deployable and space-based


Self- Assembling Electronics


RALEIGH, NC — Researchers have demonstrated a new tech- nique for self-assembling electron- ic devices. The proof-of-concept work was used to create diodes and transistors, and paves the way for self-assembling more com- plex electronic devices without re- lying on existing computer chip manufacturing techniques. “Existing chip manufacturing


atomic applications could be lifted from their cur- rent confines in labs and on benchtops? This advancement is at the heart of the effort at UC Santa Barbara engineering pro- fessor Daniel Blumenthal’s lab, where his team seeks to recreate


Andrei Isichenko holds the ring resonator (left).


quantum sensors,” says Andrei Isichenko, a graduate student re- searcher in Blumenthal’s lab. “This will impact technology spaces such as quantum comput-


Continued on page 6


techniques involve many steps and rely on extremely complex technologies, making the process costly and time consuming,” says Martin Thuo, corresponding au- thor of a paper on the work and a professor of materials science and engineering at North Carolina State University. “Our self-assem- bling approach is significantly faster and less expensive. We’ve also demonstrated that we can use the process to tune the


Continued on page 8


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