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Jan/Feb 2025 ® WE MAKE CHALLENGES
DISAPPEAR. COUNT ON ERASER TO TACKLE YOUR TOUGHEST MATERIAL PROCESSING CHALLENGES.
For more than 100 years, Eraser has provided material processing equipment for applications ranging from automotive to aerospace, health care to electronics and beyond. If our customers need a solution to cut it, strip it, twist it, clean it, polish it or measure it, they trust us to deliver it. Now see why you can too.
BRING US YOUR CHALLENGE TODAY.
ERASER.COM/USTECH
RT2S Magnet Wire Stripper
Call a sales engineer at 315-454-3237 or email us at
info@eraser.com
M700 Modular Series
Saki Intros Advanced X-Ray Inspection System
FREMONT, CA — Saki Corpora- tion has launched the 3Xi- M200v3, the latest addition to its acclaimed 3Xi-M200 AXI series. This advanced X-ray automated inspection system is designed to ensure the highest manufactur- ing quality of increasingly com- pact and slim power modules. The 3XI-M200v3 delivers high- speed and high-precision in- spections of power modules equipped with heat sinks. With a large X-ray cam-
era and optimized image processing algorithms, the 3Xi-M200v3 achieves three times the resolution of its predecessors while reducing inspection times by up to 50%. This makes it a solu- tion for manufacturing processes for compact, thin power modules, which are increasingly demanded for applications such as electric vehicles (EVs) and data cen- ters.
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er
bonization efforts, EVs and data center applications in- creasingly demand greater ener- gy efficiency, fueling the rapid expansion of power module pro- duction. These applications de- mand exceptional manufacturing quality and safety within con- fined spaces, alongside improved cooling and energy efficiency. Consequently, there is a strong push for compact and slim de- signs in power modules. To meet these demands, manufacturers are adopting advanced technolo- gies like 3D packaging and dou- ble-sided cooling in power mod- ule design. However, the trend toward smaller, thinner power
3Xi-M200v3 X-ray inspection system.
hanced CT computation capabili- ties deliver threefold resolution improvements while cutting in- spection times in half compared to previous models. These ad- vancements allow precise sepa- ration of multi-layer components within complex power modules, delivering high-resolution im- ages for faster and more accurate
inspections. Contact: Saki America, Inc.,
48016 Fremont Boulevard,
Fremont, CA 94538 % 510-623-7254 E-mail:
sales.us@
sakicorp.com Web:
www.sakicorp.com
modules presents challenges for X-ray inspection, such as achiev- ing sufficient contrast and mini- mizing interference from over- lapping layers. The new 3Xi-M200v3 rises
to the challenge with its large, highly sensitive detector, which captures high-contrast images of even ultra-thin materials. En-
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