Jan/Feb 2025


www.us - tech.com


Page 47 Terecircuits Unveils New Bonding Material


MOUNTAIN VIEW, CA — Tere- circuits Corporation, a venture- backed startup in advanced ma- terials for the semiconductor in- dustry, has introduced Tere - film®, a patented material de- signed for temporary bonding and debonding applications in advanced packaging. The next generation of in-


dustry-leading organizations will be those that realize value cre- ation is migrating towards com- panies that can design and inte- grate complex, system-level chip solutions using concepts like ad- vanced packaging. As compo- nents become smaller and more complex, the need for advanced temporary bonding materials, like Terefilm, becomes para- mount to enable emerging appli- cations, including thin wafer handling and the transfer of fragile components.


New UV Die Bonding from ESCATEC


HEERBRUGG, SWITZERLAND — Electronics Manufacturing Services (EMS) provider, ES- CATEC, has successfully inte- grated a UV light feature to its die bonder, significantly enhanc- ing the precision and efficiency of the micro-assembly processes. The team at ESCATEC


Switzerland have built a cus- tomized UV-curing system with two 365 nm light sources on the die bond head of their Tresky T6000 fully automatic machine. This solution enables ESCATEC to achieve exact positioning of components and direct snap-cur- ing required during the passive alignment process. The enhance- ment accelerates and improves the process of adhesive curing during pick-and-place operations, streamlines the manufacturing process overall, and boosts the ac- curacy of component placement, which is critical for the assembly of complex electronic parts. The UV light significantly


reduces the time required for the adhesive to set, which in turn, speeds up the entire process. This technology holds vast


potential for various applications across multiple sectors, includ- ing medical devices, automotive electronics, and industrial elec- tronics. Each of these industries benefit from increased precision and reliability with ESCATEC’s


UV-enhanced die bonder. Contact: ESCATEC


Switzerland AG, Heinrich-Wild Strasse, CH-9435 Heerbrugg, Switzerland % +41-71-727-47-14 E-mail: info.ech@escatec.com Web: www.escatec.com


See at MD&M West, Booth 3938 Terefilm meets these require-


ments, offering unparalleled ad- vantages including rapid release, precise patterning, and clean de- composition without solvents. Unlike conventional materi-


als, Terefilm undergoes a remark- ably clean decomposition process when activated, leaving no residue. This ensures ultra-clean surfaces, which are essential for successful hybrid bonding and other high-precision applications. Traditional heat and UV-


sensitive films can take several minutes to release. Terefilm,


Terefilm bonding material.


however, releases in microsec- onds. This near-instantaneous decomposition significantly en- hances manufacturing efficiency. Similar to lithographic pho-


toresists, the material can be patterned to enable selection of specific regions. This allows for the targeted release of individual chips or subsets of chips, replac- ing the traditional pick-and- place process. This capability en- ables the parallel transfer of multiple components, dramati- cally increasing production speed


and precision. Contact: Terecircuits, 319 N


Bernardo Avenue, Mountain View, CA 94043 % 650-687-7095 E-mail: mfromel@terecircuits.com Web: www.terecircuits.com


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