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www.us-tech.com Tresky Offers Ultrasonic Die Bonding DC-DC Converters
2V to 10,000 VDC Outputs 1-300 Watt Modules
Transformers & Inductors
Surface Mount & Thru-Hole
• Ultra Miniature Designs • MIL-PRF 27/MIL-PRF 21308
• MIL/COTS/Industrial Models
•Regulated/Isolated/Adjustable Programmable Standard Models
• New High Input Voltages to 900VDC • AS9100D Facility/US Manufactured
• Military Upgrades and Custom Modules
ISO 9001:2015
Certified to AS9100D
• QPL Approved DSCC •Audio/Pulse/Power/EMI Multiplex Models Available
• For Critical Applications/Pico Modules, Over 50 Years’ Experience
PICO Electronics, Inc. 143 Sparks Ave. Pelham, N.Y. 10803-1837
800 431-1064 Fax: 914-738-8225
E Mail:
info@picoelectronics.com VISIT OUR EXCITING NEW WEBSITE:
www.picoelectronics.com
HENNIGSDORF, GERMANY — Ultrasonic die bonding is a fast, clean and efficient technology in- creasingly utilized in the semi- conductor industry for the as- sembly of heat sensitive micro- electronic die. This method lever- ages high-frequency ultrasonic vibrations to create a reliable bond between semiconductor die and substrates, significantly re- ducing thermal stress. The ad- vantages of ultrasonic die bond- ing include rapid processing times, low temperatures and ex- cellent mechanical strength, making it particularly suitable for advanced applications such as RF components, MEMS and LED packaging. Ultrasonic bonding has be-
come the method of choice for processing heat-sensitive chips due to its ability to create reli- able bonds with minimal ther- mal stress. Ultrasonic bonding can there -
fore be an alternative to thermo- compression bonding in flip chip bonding. In flip chip bonding, a row of gold bumps on the bottom side of an IC are connected to gold- plated pads on a substrate. Various individual steps are
necessary to ensure that the process is carried out reliably. This includes cleaning the sur- faces of the die and the substrate and preparing them to ensure an
THERMAL FATIGUE RESISTANCE
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optimal bond. The chip is held by a die collet, which must be suit- able for ultrasonic bonding. After the die is aligned on the sub- strate by the Tresky pattern recognition system, the die is precisely positioned and exposed to controlled pressure. The ultra- sonic energy that is introduced causes the surfaces to vibrate.
Jan/Feb 2025
Ultrasonic bonding process. These vibrations break up the surface oxides and impurities, enabling contact at the atomic level. The ultrasonic parameters, i.e. power, time and delay, are adjustable in the Tresky die bon- der machine software. The com- bination of pressure and ultra- sonic energy creates a solid-state connection, whereby the materi- als are plastically formed and diffuse. This allows reproducible, stable bonds to be created be-
tween the die and the substrate. Contact: Tresky GmbH, Neuendorfstrasse 18 B, 16761
Hennigsdorf, Germany % +49-0-3302-866-92-0 E-mail:
info@tresky.de Web:
www.tresky.de
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