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FOCUS INTERNATIONAL NEWS


3D-Micromac buys Jenoptik thermal laser-separation technology 3D-Micromac has acquired


Jenoptik’s thermal laser separation technology, TLS- Dicing. The technology is used for various applications, such as the separation of microchips in semiconductor manufacturing. In a separate initiative, 3D-Micromac has joined forces with EOS to start a new company, 3D MicroPrint, which aims to advance the development and commercialisation of Micro Laser Sintering (MLS) technology. The acquisition of Jenoptik’s TLS- Dicing enables 3D-Micromac, based in Chemnitz, Germany, to broaden its portfolio of laser systems in the field of semiconductor manufacturing and also to directly market this laser technology. TLS-Dicing is used in the semiconductor industry’s back-end to separate semiconductor wafers. A laser heats up the material


NKT Photonics grants technology licence for supercontinuum laser


NKT Photonics in Denmark has licensed parts of its photonic crystal fibre technology to German company PicoQuant, which specialises in pulsed diode lasers, single photon counting and fluorescence instrumentation. Picoquant will use the technology in its new Solea supercontinuum lasers, the first of which will be on display at Photonics West. The NKT patents licensed to PicoQuant include fundamental methods of drawing and subsequently processing the fibres for use in systems, and for the use of a gain switched laser diode in the supercontinuum light sources. ‘Supercontinuum generation has been around since the sixties but it was not until we commercialised the SuperK sources, based on our patented nonlinear photonic crystal fibres, that supercontinuum lasers became a viable alternative to existing light sources,’ explained Jakob Skov, CEO of NKT Photonics.


locally and a cooling medium cools it down immediately afterwards. The thermally induced mechanical stress leads to a complete cleaving of the wafer. Tino Petsch, CEO of 3D-Micromac, commented: ‘In the


coming months, we will continue to further develop the process in co- operation with the Fraunhofer IISB and implement it in industry-ready machine technology.’ In contrast to customary separating technologies, TLS-


Dicing is characterised by clean edges without microcracks and, consequentially, by higher bending strength. Process speeds of between 200 and 300mm/s are possible resulting in higher throughput and reduced costs.


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