ADVERTORIAL TECHNOLOGY IN ACTION
Detecting Residual Oxygen Within Solder Reflow
W
ith a world that has more gadgets than people, it is not surprising that electronics has progressively
become an essential everyday part of modern life. With such a high demand from both the consumer and industrial markets, the expectation is strong when it comes to reliability and quality. Inside many gadgets you will find a PCB (printed circuit
board.) PCB manufacturers worldwide strive continuously to improve quality control in order to minimise product failure. For many PCB manufacturers, the reflow soldering process is the most popular manufacturing method, as it allows mass production of PCB’s with intricate surface mount component soldering of the highest quality. The reflow soldering process uses a solder paste to
attach multiple electrical components temporarily to their contact on the circuit board; after assembly it is then subjected to controlled heat within the solder reflow oven, melting the solder and permanently connecting the joint between the component and the circuit board.
Cambridge-Sensotec 01480 462142
www.cambridge-sensotec.co.uk
BONN Elektronik choose Variohm EuroSensor for high-power RF amplifier temperature monitoring
T
o maintain the optimal performance and reliability required for its high power amplifier stages, BONN Elektronik choose Variohm EuroSensor for the supply of custom modified temperature sensors that are an integral part of the amplifier’s performance monitoring. BONN Elektronik GmbH, based in the southern German town of Holzkirchen, is a designer and manufacturer of RF
power and microwave systems with a reputation for exceptional quality and reliability. The company produces standard and customised power amplifiers using solid state, TWT and pulsed amplifier technologies for communications applications that span low frequency subsea to broadband, GPS and satellite - with frequency ranges from the low kHz up to 50 GHz, and power ratings from a few Watts to over 30 kW. Especially at very high power levels, maintaining amplifier temperature and heating levels is a critical part of the amplifier’s monitoring system – ensuring reliability and preventatively maintaining the long service life required for BONN Elektronik’s customer-oriented specifications. Convenient mounting for the probe is an important consideration and the Variohm ETP-RT ring terminal mounted temperature probe perfectly suits the open chassis design of these power stages. In addition the ring terminal design lends itself to straightforward adaptation for EMC shielding in the very direct vicinity of the potentially high levels of electromagnetic radiation from the power amplifier module.
Variohm EuroSensors Ltd 01327 351004
sales@variohm.com
www.variohm.com
Ethernet IO Modules with Multiprotocol Functionality and M12 Power Plugs: Now Also withIntegrated Eight-Way IO-Link Master
T
he Standard for I4.0 Solutions: The new Ethernet IO modules from Pepperl+Fuchs support all common
Ethernet protocols, such as PROFINET, EtherNet/IP, and EtherCAT, in a single device. The integrated IO-Link master function allows comprehensive diagnosis and parameterization. The L-coded M12 power plug provides a current of up to 16 A and reduces installation costs. Modules with an integrated logic function can tackle autonomous applications, completely replace control panels, or deal only with status messages. As such, these fieldbus modules form the foundation for Industry 4.0 solutions.
EtherNet IO modules offer IO-Link sensor/actuator connections, function across multiple protocols, and are supplied with 16 A via the M12 power plug. The multiprotocol feature permits standardization in the machine where different module types were previously required. A rotary switch makes it possible to switch between the PROFINET, EtherNet/IP, and EtherCAT protocols. The integrated web server facilitates downloads and parameterization, and also provides a diagnostics indicator.
IO-Link-compatible sensors and actuators can be connected, configured, and parameterized using the integrated 8-way IO-Link master. Key benefits of this solution include transparent diagnosis and the ease with which devices can be replaced thanks to the redundant data storage.
The power concept with an L-coded M12 plug-in connector provides a connection and power supply of up to 16 A, thereby reducing the need for parallel wiring and supply adjustments. The robust, fully cast metal housing has an IP65/67/69 degree of protection and is very compact at only 200 mm long and 18 mm high.
Some simple programming work is all that is needed for the modules to perform distributed functions and to take the load off the central control panel, or replace this completely. Communication costs and reaction times are reduced, while a central overview is retained. The distributed logic can be limited to some of the IOs, while the others continue under the central control panel. This permits an interaction between the control panel and the distributed process program.
Pepperl+Fuchs 42 SEPTEMBER 2017 | INSTRUMENTATION 0161 633 6431
www.pepperl-fuchs.com CONNECTINGINDUSTRY.COM/INSTRUMENTATION
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