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March 2026 MIRTEC to Show 3D Technology Inspection Systems
OXFORD, CT — MIRTEC is showcasing its full lineup of ad- vanced 3D AOI and SPI inspec- tion systems at APEX Expo 2026.
MIRTEC’s flagship Anti-
Reflection Technology (ART) 3D AOI system is the world’s first 95 MP multi-camera/full HD projec- tion inspection platform. Equip - ped with five high resolution cameras and four full HD digital projectors, the system delivers unprecedented accuracy for in- specting highly reflective objects such as solder joints — an area
where conventional AOI systems have long struggled.
The breakthrough lies in ART 3D AOI system.
ART’s innovative optical archi- tecture. Conventional AOI solu- tions often rely on algorithms to fill in data lost due to specular reflections or blind spots caused by component structures. ART resolves these limitations by cap- turing 3D data from multiple di- rections, ensuring that solder joints are inspected entirely on the basis of actual measured data. Even when reflections or blind spots prevent the top-down camera from capturing accurate results, ART’s side cameras
seamlessly fill in the gaps, en- abling comprehensive inspection without compromise. MIRTEC’s GENESYS-CC for
conformal coating inspection AOI is configured with a high resolu- tion camera, lens, and 10 phase coaxial color lighting system that includes three stages of UV lights. This allows the GENESYS-CC to provide more accurate and faster inspection compared to others. It also stands out from competing conformal coating inspection sys- tems with three distinctive optical features. First, GENESYS-CC provides an option to overcome the challenges of bubble detection. MIRTEC will also display its
award-winning MV-6 OMNI 3D AOI system. It is configured with a 15 MP high-resolution CoaX - Press main camera combined with an 18 MP side camera, and MIRTEC’s exclusive 3D digital blue moiré projection technology. The MV-6 OMNI 3D AOI sys-
Bond Wire Analysis Electronics Inspection
tem will be configured with a spe- cialized 3D laser scanner attach- ment, TAL 3D SCAN, the pre-in- spection system before MV-6 OMNI. The TAL 3D SCAN can in- spect up to 70 mm parts in 3D. MIRTEC’s improved MV-3
Real-time Inspection BGA Inspection
High-resolution X-ray Technology Revolutionizing Electronics Inspection
• Nikon proprietary X-ray source with unlimited life cycle • Source collimation for protection of radiation sensitive electronics
• CT-grade amorphous-silicon digital detector with true 16-bit analog to digital converter
• Largest field-of-view detector in the industry • Fastest, most advanced 3D CT and laminography reconstruction • Available in 130 kV and 160 kV
OMNI benchtop 3D AOI system is configured with the same hard- ware and software as MIRTEC’s in-line OMNI-VISION® 3D in- spection systems providing 100% compatibility across MIRTEC’s entire 3D AOI product line. These systems feature the exclusive OMNI-VISION 3D inspection technology which combines 15 MP CoaXPress camera technology with MIRTEC’s revolutionary dig- ital tri-frequency moiré 3D system
in a cost effective platform. Contact: MIRTEC Corp., 3
Morse Road, Oxford, CT 06478 %203-881-5559 E-mail:
b.damico@mirtecusa.com Web:
www.mirtec.com
See at APEX Expo, Booth 2800
Discover our DIGITAL EDITION, where all the links
are HOT. So all the information, including a company’s web-loaded infor ma tion, is available at your fingertips.
www.industry.nikon.com
sales.nm-us@nikon.com
1 (800) 552-6648 Scan for more info See at APEX Expo, Booth 3400
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