March 2026


www.us - tech.com AdvancedPCB Drives U.S. Innovation... Continued from previous page


and layout optimization. These front-end capabilities help cus- tomers shorten development cy- cles while improving manufac- turability. Its facilities support every-


thing from standard FR-4 two-lay- er boards to complex 40-layer HDI constructions, as well as flex and rigid-flex circuits requiring ad- vanced lamination cycles. Rapid- turn capabilities allow engineers to move from design to functional boards in days, not weeks, which is critical for innovation in the aerospace, defense, and medical technology industries. In-house assembly lines of-


fer SMT, through-hole, and mixed-technology builds, along with test and inspection. Cus- tomers benefit from consolidated logistics, reduced lead times, and


Whether manufacturing


life-saving medical devices or flight-critical avionics,


AdvancedPCB provides the confidence that each board is built to the highest standards of reliability.


consistent quality control. With multiple fabrication and design sites across the United States, AdvancedPCB ensures respon- siveness and security for the pro- grams that demand it. Quality is a cornerstone of


the company and is embedded in- to its culture. AdvancedPCB op- erates under rigorous quality systems backed by certifications such as ISO 9001 and MIL-PRF standards and maintains ITAR registration to support defense programs. Every process, from raw material inspection to elec- trical testing and final assembly, is governed by traceable quality protocols. This disciplined approach al-


lows the company to serve cus- tomers in heavily regulated sec- tors. Whether manufacturing life- saving medical devices or flight- critical avionics, AdvancedPCB provides the confidence that each board is built to the highest stan- dards of reliability. “Serving aerospace, defense,


and medical customers places a premium on process discipline and supply-chain security,” notes Stoffer. “Our U.S. manufacturing footprint and certification give customers the control they need for high-reliability systems.”


Customer Engagement Beyond its technical prow -


ess, AdvancedPCB distinguishes itself through its customer en- gagement model. Through its large in-field sales team, the company integrates engineering, production, and program man- agement to reduce friction and increase transparency through-


Ultra-Precise Laser Soldering


SB² ®


Highest placement precision and smallest solder ball capability for fine-pitch probe card


Placement accuracy:  +/- 5m


2D 3D& Suitable for chip/ wafer/ substrate soldering


Recommended soldering condition: 2D and 3D soldering


Optional ball rework (de-balling & re-balling) capability: Min. ball size 150 m


out the development cycle. Its online quoting tools and


rapid response systems give en- gineers and buyers real-time in- sight into pricing, lead times, and manufacturability feedback. This agility is especially valued by OEMs balancing tight time- lines and stringent quality ex- pectations. “We’re investing to make it


simpler for engineers and pro- curement teams to move from design to validated production faster and with fewer handoffs so that customers can accelerate in-


novation without compromising quality or regulatory require- ments,” Stoffer explains. He adds that AdvancedPCB


continues executing a forward- looking growth strategy centered on customer alignment, capacity expansion, and technological ad- vancement. The company is in- vesting heavily in advanced manufacturing equipment, au- tomation, and digital tools that enhance precision and through- put while maintaining the high- est quality standards. By refining its customer sup-


port infrastructure and strength- ening program management sys- tems, AdvancedPCB is reinforc- ing its long-term commitment to PCB and assembly technology. These initiatives ensure that as customers’ requirements evolve, the company remains responsive, agile, and technically equipped to meet new challenges. Contact: AdvancedPCB,


21101 E 32nd Parkway, Aurora, CA 80011 % 303-576-6610 E-mail: gary.stoffer@ advancedpcb.com Web: www.advancedpcb.com r


Page 19


Laser Assisted Bonding (LAB) & Laser Assisted Reflow (LAR)


LAPLACE ®


In-situ bonding and reflow for low thermal stress, localized & selective heating with laser


Substitution of conventional multi zone ovens Reduced N consumption by min. factor 10


3.5D ® vertical Laser Assisted Bonding (LAB) technology


Support panel size: 600mm x 600mm


sales@pactech.de Beam size : max. 90mm x 90mm www.pactech.com Scan to learn more!


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