March 2026
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Test Research, Inc., Builds Engineering Confidence... Continued from page 53
customization, system integration, software development, turnkey test program deploy- ment, field services, and full lifecycle sup- port. Its engineering teams frequently work side by side with manufacturers to resolve unplanned challenges, accelerate line ramp- ups, and adapt inspection strategies as de- signs evolve. “We treat every customer challenge as a
puzzle to solve, not a ticket to close,” Chen adds. “Many of our most meaningful innova- tions come directly from real-world produc- tion environments, because they expose chal- lenges no lab can replicate.”
Comprehensive Portfolio At the core of TRI’s offering is
one of the most comprehensive test and inspection portfolios in the global electronics and semicon- ductor market. Its solder paste in- spection platforms deliver high-ac- curacy, shadow-free 3D inspection using quad-projector imaging, op- timized scan paths, and closed- loop process readiness. These sys- tems support applications ranging from fine-pitch micro-bump print- ing to high-volume production for networking, servers, electric vehi- cles, and consumer electronics. TRI’s AOI and conformal
coating AOI solutions build on this precision by combining AI-pow- ered defect classification, multi- angle imaging, metrology-grade accuracy, and multiple 3D tech- nologies. These systems identify solder defects, lifted leads, align- ment issues, and dimensional variances, while conformal coating AOI leverages UV-assisted inspec- tion, height mapping, thickness measurement, and surface cover- age analysis to meet stringent au- tomotive, medical, and aerospace standards. For increasingly complex as-
semblies, TRI’s AXI systems pro- vide high-resolution 2D, 3D, and computed tomography inspection for dense boards and power elec- tronics. Capabilities include AI- based void detection, plated through-hole and THT fill meas- urement, BGA joint analysis, and up to 1,000 CT slices. These sys- tems accommodate large-format boards up to 82.7 x 20.1 in. (2,100 x 510 mm), supporting applica- tions where conventional inspec- tion methods fall short. In-circuit test and manufac-
turing defects analysis remain critical pillars of TRI’s portfolio. Its next-generation ICT plat- forms support up to 11,088 test pins with true 1:1 per-pin archi- tecture, quick-disconnect inter- faces, automotive CAN and LIN testing, and integrated LED analysis. Modular MDA systems deliver high defect coverage with simplified operation and compat- ibility with robotic handling, en- abling flexible deployment across modern production lines. Beyond traditional PCB as-
sembly, TRI has made significant investments in semiconductor and
See at APEX Expo, Booth 2805 AI
- -
WHY SAKI AI IS DIFFERENT
SAKI’s AI visualizes inspection judgments and clearly explains OK/ NG decisions, eliminating uncertainty
Designed to work within current AOI - formance without requiring process
Highly reliable AI inspection reduces false calls, prevents missed defects, and delivers consistent, explainable
KEY INNOVATIONS
A user-friendly platform that enables AI model creation, learning, testing, and visualization—without special- results before deployment and main-
Dramatically reduces false calls, minimizes operator re-inspection, and improves throughput while
Fully automated text inspection with no parameter tuning, immune to font changes, misalignment, or print
EXPANDABLE BY DESIGN
SAKI’s AI Solution scales with your operation—supporting workforce long-term inspection performance
THE RESULT
-
SAKI’s AI Solution delivers the next generation of inspection—reliable, explainable, and ready for manufac-
The TRI team stands alongside one of its inspection systems, underscoring the
company’s commitment to precision engi- neering and customer-driven solutions.
Page 55
advanced packaging inspection. Its solutions address mid-end and back-end processes, in- cluding µBump and copper pillar inspection, TSV and TGV analysis, die and wire bonding verification, thin-film uniformity measure- ment, and crack or delamination detection. Systems such as the TR7950Q SII exemplify this capability through SWIR imaging, EFEM integration, and AI-driven wafer inspection and metrology.
Smart Factory Ecosystem Overlaying this hardware portfolio is
TRI’s smart factory ecosystem, which trans- forms inspection data into actionable intelli- gence. AI-driven programming, parameter op- timization, defect detection, and automated
Continued on next page
See us
at APEX 2026, Booth 2805
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