July, 2022
www.us-tech.com
HAVERHILL, MA — Seica USA is an exclu- sive distributor for Osai Automation Systems, as well as FocusedTest. At SEMI- CON West, Seica will appear with both part- ner companies and a large assortment of semiconductor equipment on display. Solutions are available for high-throughput, parallel testing, MEMS testing, product vali- dation, high-power testing, and automation applications. Seica’s PILOT NEXT>Series is a new
generation of flying probers featuring a reno- vated and sleek look thanks to the premium materials of the chassis, and innovative elec- trical design. The architecture of the PILOT NEXT>SERIES offers the possibility to exe- cute parallel testing of two single or double- side boards. This capability has a
Hitachi Intros Dark Field Wafer Defect Inspection
System SCHAUMBURG, ILLINOIS — Hitachi High-Tech Corporation has launched the Hitachi Dark Field Wafer Defect Inspection System DI2800, a critical compo- nent in any semiconductor man- ufacturer’s metrology capabili- ties. The DI2800 is a high-speed metrology system designed to identify defects and particles on patterned wafers up to 8 inches (200 mm) in diameter. With its high throughput
and performance, the DI2800 can help ensure device reliability and safety, particularly for high- ly sensitive applications such as Internet of Things (IoT) and automotive fields where 100 per- cent inspection is required. With the rise of next genera-
tion communication networks (5G) and accelerated adoption of electric vehicles in recent years there has been an increase in demand for
semiconductor
devices in the IoT and automo- tive fields where reliability and safety are paramount. In conven- tional semiconductor device manufacturing,
spot-check
inspections are performed for the purposes of process management and yield improvement. However, for semiconductor
devices used in the IoT and auto- motive fields, 100 percent inspec- tion must be carried out to help identify defective products dur- ing manufacturing to ensure high reliability and safety. To serve these fields a wafer defect inspection system must have the ability to perform 100 percent inspection with high sensitivity
at high speed. Contact: Hitachi High-Tech
America, 10 North Martingale Road, Suite 500, Schaumburg, IL 60173 % 847-273-4141 Web:
www.hitachi-hightech.com
Bond Wire Analysis Electronics Inspection
significant impact on test throughput, dou- bling it in the first case, and in the second
Page 57 Seica Demos Solutions for Semiconductor Test
case, achieving a significant increase, as well as the ROI of the test system. VIVA NEXT> software can accommo-
date, during test program execution, func- tional test sequences written using third party languages: for example Labview, VBScript, Python, and C, allowing the user maximum test flexibility. The PILOT NEXT>SERIES systems also offer fully inte- grated onboard programming solutions,
Haverhill, MA 01835 % 603-890-6002 E-mail:
davidsigillo@seicausa.com Web:
www.seica-na.com
PILOT NEXT>Series flying prober.
applied to the UUT via the mobile system. Contact: Seica, Inc., 110 Avco Road,
See at SEMICON West, Booth 2061
Real-time Inspection
BGA Inspection
High-resolution X-ray Technology Revolutionizing Electronics Inspection
• Nikon proprietary X-ray source with unlimited life cycle • Source collimation for protection of radiation sensitive electronics
• CT-grade amorphous-silicon digital detector with true 16-bit analog to digital converter
• Largest field-of-view detector in the industry • Fastest, most advanced 3D CT and laminography reconstruction • Available in 130 kV and 160 kV
SemiconW Semicon West 1 (800) 552-6648 July 12 - 14, 2022 Visit Us at Booth #529
www.nikonmetrology.com
sales.nm-us@nikon.com
See at SEMICON West, Booth 529 Scan for more info
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