July, 2022
www.us -
tech.com
Page 53 KYZEN Highlights IGBT Module Cleaner
NASHVILLE, TN — KYZEN is now offering its MICRONOX® MX2127 Universal IGBT Module Cleaner.
MICRONOX MX2127 is an
aqueous, single-phase and well- balanced chemistry designed to remove flux residues from all types of IGBT module devices. Effective on all types of flux residues, MX2127 is multi-metal safe for devices that utilize cop-
ClassOne and Fraunhofer to Develop Hybrid
Bonding EVERGREEN, MT — ClassOne Technology, a leading global provider of advanced electro- plating and wet processing tools for microelectronics manufac- turing, today announced it is partnering with the Fraunhofer Institute for Electro Nano Systems (ENAS) on hybrid bonding techniques for hetero- geneous integration of high- density pixel arrays. The work will be conducted
at Fraunhofer’s Chemnitz, Germany, facility, which is fully equipped with advanced process systems, including electroplating, chemical-mech - anical planarization (CMP), wafer aligners and bonders, and tools for all wafer cleaning steps.
The two partners will col-
laborate to develop, optimize, and integrate individual unit process steps involved in hybrid bonding of high-density pixel arrays and CMOS devices, enabling creation of thin, compact final devices for advanced imaging or sensing end products. Fraunhofer ENAS will lend its expertise in pixel array development, hy - brid bonding and the entire device integration scheme. ClassOne Technology will opti- mize its industry-leading plat- ing technology with CMP to mitigate associated process challenges, resulting in a final wafer optimally conditioned for high-yield bonding. The goal of the joint effort is to construct a scalable process that speeds the pixel array die transfer
onto the backplane wafer. Contact: ClassOne Tech -
nol ogy, Inc., 109 Coopera tive Way, Suite 101, Evergreen, MT 59901 % 406-407-7814 E-mail:
pr@classone.com Web:
www.classone.com
See at SEMICON West, Booth 1341
Clean IGBT module.
per, nickel and aluminum. With a well-balanced formu-
la, MX2127 leaves great surface conditions for post wire bond and
potting processes and retains anti-oxidation materials (Organ - ic Solderability Preservative or OSP) to protect base metals after cleaning. It is effective at low temperatures and low concentra- tion, and easily monitored in
inline SIA cleaning systems. Contact: KYZEN, 430
Harding Industrial Drive,
Nashville, TN 37211 % 615-831-0888 E-mail:
tom_forsythe@kyzen.com Web:
www.kyzen.com
See at SEMICON West, Booth 1760
Think Fast. See Small.
Next-gen multi-process inspector with the ultimate combination of high speed, high accuracy and an even higher resolution.
NEW
5 Micron Ultra-High Res MRS Sensor
AOI
SPI
CMM SQ3000™ + All-in-One Solution
NEW
For improved yields and processes. With all-in-one functionality for AOI, SPI and CMM applications to attain in-line coordinate measurements much faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours.
Powered by Multi-Reflection Suppression™ (MRS™) sensor technology, the new 5 Micron Ultra-High Resolution MRS sensor offers unmatched accuracy by meticulously identifying and rejecting reflection based distortions caused by shiny components and surfaces. The result is ultra-high quality 3D images, high-speed inspection and metrology, and improved yields and processes.
Count on the SQ3000+ for superior performance for advanced applications including advanced packaging, mini LED, advanced SMT applications for medical, military, aerospace, electronics, 008004/0201 solder paste inspection, socket metrology and other high-end CMM applications.
www.cyberoptics.com Copyright © 2021. CyberOptics Corporation. All rights reserved. See at SEMICON West, Booth 1241
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