July, 2022
www.us-tech.com
ANAHEIM, CA — This series is an excellent tool for meeting the challenging bonding applications found in the RF, microwave, semiconductor, hybrid and medical device fields. The 7KF bonder is designed with a gantry style chassis enabling virtually unlimited part size capacity. An exclusive 8:1 ratio, purely orthogonal x/y/z micromanipu- lator allows the operator of the machine to place bonds very precisely, and with ease. The 7KF series machines are convertible
between ball bonding and wedge bonding, pre- senting bond wire at both 45 degrees for opti- mal loop and tail control, and 90 degrees for deep access and ribbon bonding capabilities. Conversions between setups are made in mere minutes, using a single tool head. The machine features storage
for up to 30 device configuration profiles, or buffers, per mode of operation. Each buffer can store up to 21 bonds with individual ultra- sonic power, time, force, and loop elevation settings per bond. The programming of each setting, oper- ation of the machine, action prompts, and fault diagnostic infor-
GEN3 Installs Nordson Selective Soldering at UK EMS
FARNBOROUGH, UK — Gen3 has supplied two Nordson Cerno 300.1S selective soldering systems to Stewart Technology in Tweed - bank, Galashiels, Scot land. The Cerno 300.1S system
that was selected by Stewart Technology is a compact inline selective system featuring com- bined fluxing, preheating and selective soldering, offering exceptional value and superior process control and is ideally suited for prototype, small batch in-line production or cell manu- facturing requirements. This system combines flux-
ing, preheating and selective sol- dering in a compact footprint. This system is capable of selec- tive soldering printed circuit boards at the same speed as larg- er or more expensive machines, it is a cost-effective solution for customers’ production lines. The Nordson SELECT selec-
tive soldering systems have been honored with prestigious awards for innovation and excellence. The company is recognized
for its innovative products and abilty to offer a full spectrum of solutions including standalone, inline and multi station high-vol-
ume soldering systems. Contact: Gen3 Systems,
Ltd., Armstrong Mall, Farn bor - ough, Hampshire, GU14 0NR, UK % +44-0-12-5252-1500 E-mail:
sales@gen3systems.com Web:
www.gen3systems.com
See at SEMICON West, Booth 2061
mation is displayed and input on the machine’s 7 inch capacitive touch sensing LCD. The 7KF series machines feature pro- grammable force, primary and secondary ball
Page 51 West-Bond Debuts New Wirebonding System
sizes, pure vertical z-motion, and program- mable radiant tool heat. High and low fre- quency versions of the machine are available as the 7KFH and 7KF respectively. The 7KF series uses an open frame
design, the 7KFX models remove the base and work platform of the machine and enable mounting the machine to a tabletop or con- veyor system. Additionally, risers are avail- able for the machine to support working with
extra tall parts. Contact: West-Bond, Inc., 1551 South
Harris Court, Anaheim, CA 92806 % 714-978-1551 E-mail:
sales@westbond.com
7KF bonder.
Web:
www.westbond.com See at SEMICON West, Booth 2340
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