February, 2016
www.us-tech.com
IPC APEX Programs Emphasize Research, Innovation, and Forward Thinking
Bannockburn, IL — The latest techni- cal research, best industry practices, ground-breaking technologies, and for- ward thinking innovations will take center stage through the IPC APEX® 2016 technical conference and profes- sional development courses. The event is scheduled for March 13-17 at the
IMAPS to Hold 12th Device
Las Vegas Convention Center in Las Vegas, Nevada. In keeping with the event’s
theme, “Forward Thinking for Tomor - row’s Technology,” the technical con- ferences will present approximately 80 technical papers detailing original research and innovations from indus- try experts around the world. Industry experts will cover topics in the areas of board fabrication and design, electronics assembly and test. Attendees seeking to learn more
Packaging Conference
Durham, NC — The International Microelectronics Assembly and Packaging Society (IMAPS) will hold its 12th annual Device Packaging Conference in Fountain Hills, Arizona, March 15-17. The confer- ence is a major forum for the exchange of knowledge and provides numerous technical, social and net- working opportunities. Experts in the fields of interposers, 3D IC and packaging, flip chip, wafer level packaging and fan-out, as well as SiP and engineered micro systems, will be present. The schedule of events includes
the conference itself and technical workshops, technology showcases, and professional development cours- es. New this year is a GBC plenary session which will be held the second day of the event. The conference attracts a
diverse group of people within the industry and academia. It provides a chance for educational interactions across many different functional groups and levels of experiences. The 2015 conference welcomed
606 total participants from 19 coun- tries, and was the second highest count for the conference. This year should prove to be just as successful. Contact: IMAPS, P.O. Box
110127, Research Triangle Park, NC 27709 % 919-293-5000 fax: 919-287- 2339 E-mail:
bschieman@imaps.org Web:
www.imaps.org
MD&M West Major Focus Industry 4.0
Continued from previous page
programs that aid engineers and architects, will be covered. Josh Thomas and Shawn Moyer
of Atredis Partners will discuss the security necessary to protect an interconnected factory, and some of the vulnerabilities that come with the Industrial IoT. Concluding the seminars, Aur -
elio Banda of Beckhoff Auto ma tion will speak on efficient machine-to- machine communication. Contact: UBM, 2901 28th
Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 E-mail:
pam.moore@
ubm.com Web:
www.ubmcanon.com
about best practices in design, lead- free technologies, materials, process improvement, solder joint reliability, PCB fabrication and materials, qual- ity and reliability, and others, will be
able to choose from 20 professional development courses. The courses are designed to go beyond theory and provide practical solutions, which can be implemented immediately. “Our wide-ranging educational
program includes a variety of learning opportunities where attendees can access the latest research and devel- opment in the industry, and learn more about trending materials, appli- cations and processes — such as graphene, printed electronics and 3D printing,” said IPC Technical Con - ference Director, Jasbir Bath. “They can take everything they learn back to their company and put it to work.” In addition, the conference will
contain free activities, including technical buzz sessions, poster pre- sentations, keynotes on “Inventions and Innovations” by inventor and entrepreneur, Dean Kamen. Also, Peter Singer, a strategist and senior fellow at the New America Foun - dation, will present “Inside the Rise of the Warbots.” Also scheduled for the conference is the popular New Products Corridor, and the APEX Expo Hand Soldering Competition. Contact: IPC, 3000 Lakeside
Drive, Suite 105 N, Bannockburn, IL 60015 % 847-615-7100 fax: 847-615-7101 E-mail:
answers@ipc.org Web:
www.ipc.org
Page 93
FOR TOMORROW’S TECHNOLOGY
Think Forward PLAN NOW FOR IPC APEX EXPO 2016
Where will you prepare for tomorrow in 2016? At the premier electronics manufacturing industry event: IPC APEX EXPO 2016, of course. Get ready to experience a renowned combination of education, technology, networking, and the largest collection of industry suppliers…all geared to provide the forward thinking you need to create tomorrow’s technology.
SEE YOU IN MARCH!
PREPARE FOR TOMORROW’S TECHNOLOGIES BY REGISTERING TODAY!
Join our keynote speakers for a unique look at how the industry will redefine the concept of “business as usual”.
Dean Kamen, Inventor & Entrepreneur “Inventions and Innovations”
Peter Singer, Strategist and Senior Fellow at the New America Foundation “Inside the Rise of the Warbots”
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