Winners 2011  CS Industry Awards Epiwafer Processing Award


EVG 850TB/DB: Temporary Bonding/Debonding Systems


Thin wafer processing is a key enabling technology for compound semiconductor applications such as high-brightness light emitting diodes (HB-LEDs), power devices, radio-frequency (RF) devices, micro-electro- mechanical systems (MEMS), and most recently for through-wafer-via (TWV or TSV for silicon substrates) applications and 3D chip stacking. Handling and processing of thin wafers is quite delicate and requires thin wafer specific equipment modifications for further processing. Especially the high fragility of III-V compound semiconductors makes them prone to wafer breakage. A far more cost-effective method is temporary bonding of the device wafer to a carrier wafer prior thinning. This carrier wafer provides mechanical stability to the thinned device wafer. The main advantage of this approach is that the device wafer thickness can be further reduced, enabling further improved device performance.


Additionally, temporary bonded wafers can be handled and processes like standard bulk wafers. In this way the whole front- end and back-end foundry as well as packaging infrastructure can be utilized.


After thinning and/or backside processing the device wafer is debonded. The debonding technology is the cornerstone of thin wafer handling. The EVG 850TB/DB Temporary Bonding / Debonding system, an integral part of EVG industry proven range of HVM ready production wafer bonding systems, integrates the bonding and debonding steps of thin wafers, as well as cleaning and film frame mounting, in one system.


Alternatively the thin wafers can be loaded into coin stacks or put onto thin wafer carriers. Adding only two process


steps, temporary bonding and debonding, allows thin


wafer processing on standard equipment in any existing fab.


Editors Comment: Tremendous innovation within the III-V industry is leading to the creation of many different device architectures requiring wafer thinning. EVG’s tool will help these devices leap from lab to fab.


June 2011 www.compoundsemiconductor.net 27


WINNER


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