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TECHNOLOGY GaN SUBSTRATES


Hybrid approach yields the best GaN crystals and wafers


Marrying HVPE and ammonothermal growth techniques will accelerate the production of ultra-high quality GaN


BY MICHAL BOCKOWSKI FROM THE INSITUTE OF HIGH PRESSURE PHYSICS, POLISH ACADEMY OF SCIENCES AND ZLATKO SITAR FROM THE WIDE BANDGAP LABORATORY AT NORTH CAROLINA STATE UNIVERSITY


IF A PERFECT PROCESS were to exist for forming boules of GaN, it would create material that is completely free from dislocations, impurities and bow. In addition, this process would quickly yield crystals with very large dimensions, so that substrates sliced from them would provide a cheap, ideal foundation for the manufacture of LEDs, lasers and power electronics.


However, as we all know, such a process does not exist. Instead, makers of GaN devices have to choose between a far-from-perfect native platform that is very pricey – a 2-inch GaN substrate retails for $2000 or more – and several options for larger, foreign substrates that have the drawback of leading to inferior material quality. Makers of laser diodes don’t actually have this second choice, because they must work with


very high quality material, so GaN is used. However, for the manufacturers of LEDs and transistors, GaN is nearly always deemed to be too expensive, so sapphire, silicon and SiC are widely adopted. These foreign substrates all have a lattice mismatch to GaN that leads to the generation of copious defects in the epistructures, resulting in the loss of device performance and lifetime.


It should be possible to address the lack of an affordable, ultra-high-quality GaN substrate with a process that has been developed by partnership between the Institute of High Pressure Physics of the


Polish Academy of Sciences (IHPP PAS), working in close partnership with both Ammono S.A. and scientists at the Wide Bandgap Laboratory at North Carolina State University (NCSU). This team that we are part of employ a technology that involves uniting two existing techniques: HVPE and ammonothermal growth.


Virtues of HVPE Strengths of the former, HVPE, include a relatively high growth rate, which can exceed 100 μm/h, and a possibility to crystallize high-purity material. Thanks to these attributes, HVPE is a well- established method for making GaN substrates – this growth technique is employed by the likes of Sumitomo Electric Industry, Hitachi Metals, Furukawa Co, Mitsubishi Chemical, and Saint Gobain (formerly Lumilog).


These leading manufacturers of GaN begin by placing a foreign substrate, typically sapphire or GaAs, into a HVPE reactor, before heating the chamber to around 1300K. Introducing ammonia and gallium chloride at ambient pressure leads to the crystallization of GaN on foreign substrates, and when this thick film is removed via etching or self- separation techniques, a GaN substrate results.


Fig. 1: a) A polished 2-inch GaN wafer produced by Ammono S.A. (courtesy of Ammono S.A.); b) An atomic force microscope image of the epi-ready (0001) surface of the Ammono-GaN wafer after chemo-mechanical polishing; the image shows the desired bi-layer steps; root-mean-square roughness is below 0.1 nm (courtesy of G. Kamler and G. Nowak, IHPP PAS).


48 www.compoundsemiconductor.net June 2014


Manufacture of these GaN substrates is well established. For example, market leader Sumitomo already demonstrated 6-inch freestanding material back in


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