This page contains a Flash digital edition of a book.
news digest ♦ Equipment and Materials Equipment Technology Strategist.


The Cee 300MXD megasonic developer gives customers a bridge from the lab to production by allowing them to avoid significant capital investment and is suitable for low- volume prototyping with a seamless transition to high-volume manufacturing.


Brewer Science announce Apogee temporary wafer bonder


New bonder completes Brewer Science tool suite for low- volume production or R&D lab environments


Brewer Science, Inc., a supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry, has unveiled the Brewer Science Apogee bonder for temporary wafer bonding applications.


The Apogee bonder supports multiple temporary bonding/ debonding technologies including thermal slide, mechanical peel, and laser release debonding. The Apogee bonder completes the Brewer Science thin wafer handling tool suite for low-volume compound semiconductor production of RF filters, analog power devices, LEDs, and solar devices.


Brewer Science says this collection of tools provides reduced time to market for ultrathin wafer technologies using integrated material and process solutions.


The Brewer Science Apogee features include: Substrate size range of 50-300 mm


Dual rigid platens heat wafer stack from both sides, minimizing thermal defects


Ultraflat self-leveling platens minimize total thickness variation (TTV)


Evacuated bond chamber eliminates voids


Carrier and device are separated during pre-bond evacuation Total thickness variation:


Semiconductor veteran joins Veeco as CFO


Maheshwari brings more than twenty years of experience in engineering and finance to Veeco


Veeco Instruments has appointed Shubham Maheshwari, 42, as its new Executive Vice President, Finance and Chief Financial Officer (CFO). Maheshwari replaces David D. Glass, who announced his retirement from Veeco last December.


Shubham Maheshwari, Executive Vice President, Finance and Chief Financial Officer, Veeco


Maheshwari most recently served as Chief Financial Officer of OnCore, a global manufacturer of electronic products in the medical, aerospace, defence and industrial markets.


Prior to this role, he held various finance roles including Senior Vice President Finance, Treasury, Tax and Investor Relations at Spansion, a global developer of Flash memory based embedded system solutions. Maheshwari helped lead Spansion’s emergence from bankruptcy to become a successful public company.


Prior to Spansion, he spent over ten years at KLA-Tencor, a global semiconductor capital equipment manufacturing company, in various senior level corporate development and finance roles, including Vice President of Corporate Development and Corporate Controller. During his tenure at KLA-Tencor, he worked on over $1 billion in acquisition transactions.


He holds a B.S. in Chemical Engineering from the Indian Institute of Technology in Delhi, India, an M.S. in Chemical Engineering from Kansas State University, and an MBA from the Wharton Business School, University of Pennsylvania.


John Peeler, Veeco’s Chairman and Chief Executive Officer, comments, “Shubham brings an ideal mix of highly relevant financial leadership experience to Veeco. I am confident he will hit the ground running to help take Veeco to the next level of performance. I’m extremely pleased that Shubham has joined our leadership team.”


“Veeco is a great match for me and I’m excited to come on board,” comments Maheshwari. “Veeco has done an impressive job managing through an extended downturn, but I think the best is still in front of the Company. I look forward


102 www.compoundsemiconductor.net June 2014


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108