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hi-TeCh evenTS
www.us-tech.com IPC ESTC Expo to Launch in May
Bannockburn, IL —IPC is launching a brand-new conference and expo designed to bring together four major disciplines under one roof: foundry, components, board assemblies, and complete systems. Each one of these areas has shows of its own; the idea is to combine them all in one place and time. The kickoff of the new expo, called ESTC™ (Electronic System Technologies Conference and Exhib - ition) is scheduled for May 20-23 at The New Tropicana in Las Vegas. The Conference’s 13 tracks will be cover- ing: product design and development;
assembly and SMT; PCB fabrication, materials, and design; quality and reliability; fab and silicon; text; equip- ment, tools and modules; packaging and substrates; mechanics; thermals; electrical; materials; industry analysis and issues. IPC ESTC will include a 25,000
sq. ft. exhibition hall, open on May 21-22, a technical conference, key - note presentations, professional development courses, sponsored workshops, networking receptions, luncheons, and standard develop- ment meetings. These are aimed at
SMT Hybrid Packaging in Nuremberg
Nuremberg, Germany — The SMT Hybrid Packaging Conference, Tutor - ials and Workshop is set to run April 16-18 at the Nuremberg Exhibition Centre, Nuremberg, Germany. In addition to the exhibition,
the SMT Hybrid Packaging confer- ence and tutorials are the most important platform for information and networking in the field of micro electronics manufacturing in Europe. The program consists of a high- class, user-oriented conference day in
German, which deals with current issues. In addition, a large number of practice-oriented half-day tutorials in German and English offer infor- mation and first-hand results. International experts from
industry and science will present. All delegates are invited to discuss and
to exchange their experiences. Contact: Kallman Associates,
Inc., 20 Harrison Avenue, Waldwick, NJ 07463-1709 % 201-652-7070 E-mail
jerry@kallmanexpo.com
Nanoelectronics Conference/NIST Gaithersburg, MD — How the semi- conductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25- 28, 2013, at its campus in Gaithersburg, MD.
2013 ISSUE Jan/Feb March EDITORIAL
Assembly & Packaging Electronics West/MDM PP APEX PP
Test & Measurement Assembly New England PP
April/May SMT & Production SMT/Hybrid/PKG PP Nepcon China PP EDS PP
June July August
Components & Distribution Atlantic Design PP Test & Assembly
Semicon West/Intersolar PP
Production & Packaging Nepcon South China PP
September PCB & Test IPC Midwest PP PCB West PP IMAPS PP
PCB West PP IMAPS PP
October October
Nov/Dec Nov/Dec
SMT & Assembly SMTAI PP
SMT & Assembly SMTAI PP
Productronica PP Productronica PP
PP= Product Preview
Components & Distribution El t i W t/MDM PP
Components & Distribution Electronics West/MDM PP
Nepcon South China
Autotestcon IPC Midwest PCB West PP IMAPS SMTAI
PCB West PP IMAPS SMTAI
MDM Minneapolis Productronica
MDM Minneapolis Productronica Fabtech
Fabtech El t i W t/MDM
Electronics West/MDM 8/27 - 8/29
9/17 - 9/19 TBD
9/24 - 9/26 10/1 - 10/3
9/24 - 9/26 10/1 - 10/3
10/15 - 10/17 10/30 - 10/31 11/12 - 11/15
10/15 - 10/17 10/30 - 10/31 11/12 - 11/15
11/19 - 11/21 2/10 - 2/12 2014
11/19 - 11/21 2/10 - 2/12 2014
Shenzhen, China S
Schaumburg, IL Schaumburg, IL Santa Clara, CA Orlando, FL
g,
Santa Clara, CA Orlando, FL
Ft. Worth, TX Minneapolis, MN Munich Germany
Chicago, IL A h i CA
Chicago, IL Anaheim, CA
Ft. Worth, TX Minneapolis, MN Munich Germany
SHOW
EDITORIAL CALENDAR DATE
LOCATION DesignCon
Electronics West/MDM APEX APEC
Assembly New England
SMT/Hybrid/PKG Nepcon China Del Mar Electronics EDS
Wire Processing Tech Eastec
Atlantic Design Semicon West/Intersolar
1/29 - 1/30 2/12 - 2/14 2/19 - 2/21
3/19 - 3/21 4/10 - 4/11
4/16 - 4/18 4/23 - 4/25 5/1 - 5/2 5/7 - 5/9 5/8 - 5/9
5/14 - 5/16 6/18 - 6/20 7/9 - 7/11
Santa Clara, CA Anaheim, CA San Diego, CA
Long Beach, CA Boston, MA
Nuremberg, Germany Shanghai, China San Diego, CA Las Vegas, NV Milwaukee, WI
W. Springfield, MA Philadelphia, PA San Francisco, CA
As the devices lying at the heart
of computing shrink ever closer to fundamental limits, the semiconduc- tor industry must confront the prob- lem of what to do when conventional microprocessors simply cannot shrink any further. The bi-yearly conference will be attended by inter- national representatives from indus- try, government and academia. Web:
http://nist.gov/pml/div683/conference/
OEMs; IDMs; fabless semiconductor companies; semiconductor foundries; outsourced semiconductor assembly test services; EMS providers; PCB manufacturers; original design man- ufacturers; equipment, materials and service providers; academia and research centers. The confab will include collabo-
ration with SMTA in presenting con- ferences, courses, and workshops. It is expected that the speakers list will read like a who’s who in the compo- nents industry. This inaugural event will include synergy with IEEE — although there is no indication that IEEE or SMTA will continue the relationship after this event.
The event is expected to bridge
the gap between components and systems perspective. And during all of this, IPC committees will be work- ing to develop standards for box build, something the association has been working on for the past 2 years. Companies involved in testing
will also be at ESTC, and will provide unique technical conferences. Covered box build systems will
include computer, telecomm, aero- space, medical device markets. The entire electronics supply chain will
be covered, in this all-inclusive expo. Contact: IPC % 877-472-4724
or 847-597-2860 Web:
www.ipc.org or
www.estc.ipc.org
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
Mar. 11-14, 2013, IMAPS 9th International Device Packaging Conference
and Exposition. *Radisson Fort McDowell Resort and Casino, Scottsdale, AZ. Contact: IMAPS, 611 2nd St. N.E., Washington, DC 20002 % 202-548-4001 fax: 202-548-6115 Web:
www.imaps.org
Mar. 18-21, Composites Manufacturing. *Long Beach Convention Center, Long Beach, CA. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.sme.org/composites
Mar. 19-21, 2013, AERODEF Manufacturing. *Long Beach Convention Center, Long Beach, CA. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.aerodefevent.com
Apr. 7-10, IEEE Wireless Communications & Networking Conference. *Shanghai International Convention Center, Shanghai, China. Contact: IEEE Communications Society, Web:
www.ieee-wcnc.org/2013
Apr. 10-11, Electronics New England.*Boston Convention and Exhibit Ctr., Boston, MA Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-996-9495 or
vu.nguyen@
ubm.com Web: http:
www.electronics-NE.com
Apr. 8-12, Hannover Fair. *Hannover Fairgrounds, Hannover, Germany. Contact: Hannover Fairs USA, Inc., 212 Carnegie Center, Princeton, NJ 08540. % 609-987-1202. E-mail:
hannoverfair@hfusa.com Web:
www.hfusa.com
Apr. 16-17, 2013, Micromanufacturing Conference and Exhibits. *Hilton Minneapolis, Minneapolis, MN. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.sme.org/micro
Apr. 16-17, Medical Manufacturing Innovations. *Hilton Minneapolis, Minneapolis, MN. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.sme.org/mmiusa/
Apr. 23-25, NEPCON China 2013. *Shanghai World Expo Convention & Exhibition Center, Shanghai, China. Contact: Reed Exhibitions China, 1-3 Xinyuan South Road, Chaoyang District, Beijing, Ping An International Finance Center A, Floor 15, China 100027 % +86-10-5933 9346 fax: +86-10-5933 9333 E-mail:
inquiry@reedexpo.com.cn Web:
www.reedexpo.com.cn or
www.nepconchina.com
May 8-9, Electrical Wire Processing Technology Expo.*Delta Center, Milwaukee, WI. Contact: Expo Productions, Inc., 510 Hartbrook Drive, Hartland, WI 53029 %800-367-5520 or 262-367-5500 E-mail:
cheryl@epishows.com Web:
www.epishows.comilton
May 14-16, EASTEC. *Eastern States Exposition, West Springfield, MA. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.easteconline.com
May 20-23, IPC Electronic System Technologies Conference.*New Tropicana Hotel, Las Vegas, NV. Contact: IPC % 877-472-4724 or 847-597-2860 (outside U.S. & Canada) Web:
www.ipc.org or
www.IPC.org/ESTC
Aug. 22-23, IPC Midwest. *Renaissance Schaumburg Hotel & Convention Center, Schaumburg, IL. Contact: IPC %877-472-4724 or 847-597-2860 (outside U.S. & Canada) Web:
www.ipc.org or
www.IPCMidwestShow.org
Sept. 25-26, Mid-Atlantic Design-2-Part Show. *Greater Philadelphia Expo Center,
Phoenixville, PA. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web:
www.d2p.com
Oct. 1-3, IMAPS. *Rosen Centra Hotel, Orlando, FL. Contact: IMAPS, 611 2nd St. N.E., Washington, DC 20002 %202-548-4001 fax: 202-548-6115 Web:
www.imaps.org
Oct. 15-19, WESTEC. *Los Angeles Convention Center, Los Angeles, CA. Contact: SME, One SME Drive, Dearborn, MI 48121 %800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
http://westeconline.com or % 800-733 4763.
March, 2013
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