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www.us-tech.com
March, 2013
Components Corp Adds Single-Molded Color Coded Test Points
Denville, NJ —Components Corpora- tion has expanded its product offer- ings to include a series of single- molded test points, eliminating the standard cut edge. The color-coded plastic stand-offs of the new TP-104,
TP-106 test point contact provides a profile which stands above circuitry, offers a positive anchor for spring loaded clips or probe tips, and is large enough to terminate conventional al- ligator clips. The TP-106 is designed
Single-molded test point.
TP-105, and TP-106 enhance visibili- ty for polarization and identification on circuit boards. The single-molded TP-104 incorporates non-slip grip of test clips and probes, a low profile, and is single hole wave-solderable, eliminating skin punctures suffered by users of wrap posts as substitute test points. The TP 104 is now avail- able without a burr. The TP-105 test point offers a loop profile for positive test probe retention, fits in the popu- lar .035” diameter hole size, and is available without a burr. The above board profile is below that of headers and other devices used as test points, enabling it to accommodate a refit without printed circuit board layout re-design costs, reducing test point height, and improving function. The oval loop design of the single molded
to withstand the temperatures of pro- duction wave soldering processes and resist board cleaning solvents or chemicals and is manufactured with- out a burr. Products may be specified for use in a wide range of applica- tions, all abiding by the current Di- rective 2011/65/EU RoHS and EU
Regulation EC 1907/2006. Contact: Components Corpora-
tion, 6 Kinsey Place, Denville, NJ 07962 % 973-627-0290 E-mail:
sales@componentscorp.com, Web:
www.componentscorp.com
New Low Temp Cure Die Attach Adhesive from EMS
Delaware, OH — Engineered Materi- al Systems debuts its 561-50 low tem- perature cure die attach adhesive for attaching semiconductor die in tem- perature-sensitive devices. The new electrically conductive d adhesive fits smart card, camera module, flex cir- cuit, and other temperature-sensitive applications. The 561-50 is more than 90 per-
cent cured after 30 minutes at 80°C, but has a dispensing work life greater than 48 hours (measured as a 25 per- cent increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability. The flexibility of the adhesive suits applications with high peel strength as it can withstand the stresses in- duced in flexible electronics and dis- play applications and can be fast cured at elevated temperatures (1
minute at 180°C). Contact: Engineered Materials Systems Inc., 132 Johnson Dr.,
See us at NEPCON China
Delaware, OH 43015-8699 % 740-362-4444 fax: 740-362-4433 Web:
www.conductives.com
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