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www.us-
tech.com Rotary Position Sensor Piher Intros Tiny
Chicago, IL — Piher Sensors and Controls has introduced the MTS- 360 Mechanical Mount Rotary Position Sensor with integral PCB for fast and easy mounting. Designed with the sensor directly mounted onto a PCB, the innovative MTS-360 Sensor/PCB Combo package allows engineers to easily install a fully featured rotary sensor without first having to design a printed circuit board for the sensor. The result is time-savings and convenience, and sim- plified (mechanical) installa- tion.
The MTS-360 assembly
is available with either 6 pin (dual output) or 3 pin (single output) Molex 90119 Series mating connectors. The PCB / Sensor assembly can be easily secured with three standard M3 screws. The entire assembly meas- ures just 35mm wide by 36mm long and 7.5mm high, allowing for appli- cations with tight packaging con- straints. The MTS-360 relies on patented
Hall Effect technology to enable true non-contacting through-hole shaft sensing. The standard model has a 4mm double D-flat through-hole and
Rotary position sensor with integral PCB.
+125°C environments, the sensor can operate up to 333 RPM and can be programmed with full scale output with angles as narrow as 15 or as
wide as 360°. Contact: Piher Sensors &
Controls SA, Polígono Industrial Municipal, Vial T2 Nº22, 31500 Tudela, Spain % +34-948-820450 fax: +34-948-824050 E-mail:
piher.sales@
meggitt.com Web:
www.piher.net
three slotted mounting holes allow- ing final rotational adjustment at assembly. Performance features include
electrical angles up to 360° with no dead band and linearity as low as ±0.5 percent. Rated for use at –40 to
March, 2013
Thermacore: Technology Breakthrough for DoD
Lancaster, PA — Thermacore, Inc. is offering a new generation of compact, custom-built, high-performance air- cooled heat sinks. The new heat sink products reflect advances by Therma - core in the development and commer- cialization of active heat sink tech- nologies, achieved as part of the DARPA Micro-technologies for Air- Cooled Exchangers (MACE) program. After the results of the company’s
initial MACE demonstration step exceeded DARPA expectations in early 2011, The company proceeded to develop four varieties of passive heat sink products, all representing improved airside heat transfer per- formance over existing state-of-the-art heat sinks. The design integrates Ther ma -
core’s Therma-Base Vapor Chamber technology within a 3-dimensional thermal solution, with vapor flow spreading heat both laterally in the base and into planar ap pendage heat pipe blades. High-density fins are attached to the planar blades for enhanced thermal performance. According to the company, a key
element in the new product line is the vapor chamber technology that Thermacore has used successfully for many years. These compact, high-perform-
Compact, high performance
air-cooled heat sinks for 3U to 6U electronics formats.
unmanned aircraft, vetronics in ground vehicles, military radars, medical electronics and computer
server microprocessors. Contact: Thermacore, Inc., 780
Eden Rd., Lancaster, PA 17601 % 717-569-6551 fax: 717-569-8424
E-mail:
info@thermacore.com Web:
www.thermacore.com
ance air-cooled heat sink products will handle heat loads from 250 Watts to 2,000 Watts depending on model. Typical thermal applications for the new product line include cool- ing avionics in manned and
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