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www.us- tech.com


December, 2011


RASIRC Intros Steamer Turbo with Hot Gas Blending


San Diego, CA — RASIRC® has intro-


duced the new Steamer Turbo for specialty applications in the semicon- ductor and photovoltaic industries. This is the company’s first steamer with integrated gas blending control, which reportedly solves the common problem of condensation when blend- ing steam with compressed gases. The unit delivers high flow


rates of steam combined with nitro- gen or oxygen, which can improve the uniformity of thermal oxide films and momentum for particle removal after condensation. The company’s prod-


ucts deliver ultrapure water vapor for semiconductor, photovoltaics, nanotechnology, and other manufac- turing applications. A variety of semiconductor and


photovoltaic manufacturing process- es require that water vapor be mixed with nitrogen or oxygen. To avoid condensation, the gases must be heated above the steam dewpoint, minimally 80°C or hotter, for those applications that need to impart more energy to the substrate upon contact. Without tight gas tempera- ture control there is a serious risk of


premature condensation leading to contamination and film non-unifor- mities. The Steamer Turbo solves this


problem by incorporating an inte- grated compressed gas control sys- tem that can deliver up to 100 slm of gas at 120°C. The control system includes a mass flow controller, regu- lator, filter, and in-line gas heater. The close coupling of the gas heater to the purified steam outlet ensures cleanliness and controls the tempera- ture of the blended gas, thus virtual- ly eliminating condensation.


Combining the company’s


patented steam purification technol- ogy with UHP steam generation and hot compressed gas provides a unique method to deliver both energy and ultrapure water through conden- sation at the wafer surface. The inte-


Steamer turbo pro cleans semicon wafers.


gration of hot compressed gas pro- vides a sweep gas to move the con- densed steam away from the wafer. This can enable new forms of wafer cleaning not possible before. Contact: RASIRC, 11760


Sorrento Valley Road, Suite E, San Diego, CA 92121 % 858-259-1220 E-mail: info@rasirc.com Web: www.rasirc.com


Techcon Adds 34 Gauge


Dispense Tip Garden Grove, CA — Techcon Systems, a product group of OK International, has added the new 34- gauge dispense tip to its product line.


New dispense tip.


With an inside diameter range of 0.003 to 0.0045-in.


(0.076 to


0.114mm), the new 34-gauge tip is especially suitable for dispensing micro shots of low-viscosity fluids. The 34-gauge tip consists of an


electro-polished stainless steel can- nula for consistent material flow and a double helix polypropylene hub with lime green coloring for easy identification. In addition, the new tip is silicone- and chloride-free. The tip is available in both bulk


quantity (TE734025-1000) and packs of 50 pieces (TE734025PK). Contact: OK International,


12151 Monarch St., Garden Grove, CA 92841 % 714-799-9910 fax: 714- 799-9533 Web: www.okinternation- al.com or www.techconsystems.com


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