December, 2011
www.us-
tech.com
SEHO: New Software Feature Ensures Reliability
Kreuzwertheim, Germany — SEHO Systems GmbH is introducing a new software function for its selective sol- dering system — the PowerSelective. The new function ensures even high-
ture available for the PowerSelective guarantees an automated and reli- able procedure. During program generation for
the mini-wave soldering process, the operator specifies all board areas that are mechanically supported and gives a correct z-level. Typically, these areas are at the gripper sup- ports or the edges of a carrier in which the boards are processed. A reference point is defined within this area. In addition, the operator speci- fies an arbitrary number of points on
the soldering side of the assembly. During operation, a high-preci-
sion laser measuring system deter- mines the actual distance of the PCB from the previously defined points prior to soldering. These values and the z-height of the reference point are the basis for a precise calculation for modeling and illustrating an alti- tude profile for the assembly in process. All points of the soldering program are set off against the mod- eled value, ensuring that all points are soldered at the optimum height
regardless of actual board warpage. The PCB warpage compensa-
tion, together with the automatic PCB alignment based on fiducial recognition, guarantees optimum and highly reproducible xyz position- ing, thus going one step further in zero-fault production. Contact: Seho North America,
Inc., 1420 Jamike Drive, Erlanger, KY 41018 % 859-371-7346 fax: 859-282-6718 E-mail:
sehona@sehona.com Web:
www.sehona.com or
www.seho.de
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System automatically compensates for PCB warpage.
er process reliability by compensat- ing for product or production-related warpage of the assemblies to be processed. Assemblies to be handled in a
selective soldering process often do not show the necessary planarity. This warpage may be due to many reasons such as unsymmetrically loaded components, scoring or ten- sions resulting from previous ther- mal and mechanical processes. Any deformation, however,
directly affects the z-coordinates in the subsequent selective soldering process, creating the potential for defective PC boards. To achieve a reliable and reproducible process, particularly critical assemblies require careful consideration on a per-board basis to compensate for any distortion. The new software fea-
BPM: Fastest Programming
Speeds Houston, TX — BPM Microsystems has released BitBlast for 8th Generation and Flashstream®
MK2
device programming solutions. BitBlast is a Vector Engine Co- Processor®
enhancement that is able
to achieve the fastest programming speeds for high-density managed NAND devices that utilize the eMMC interface. By using the company’s model 2800 with the new BitBlast technology, the user can reach a pro- gram plus verify time of 460 seconds on Toshiba’s 4GB THGBM1G5D2 - EBAI7, beating its nearest competi- tion by 307 seconds. The Vector Engine Co-Processor
is designed to accommodate the tech- nological advancements in the device programming industry. As newer and faster devices are introduced into the market, the technology will adapt to the faster speeds. BitBlast can be attained via
firmware changes in many instances. Contact: BPM Microsystems,
5373 West Sam Houston Pkwy N, Suite 250, Houston, TX 77041-5160 % 800-225-2102 or 713-688-4600 fax: 713-688-0920 E-mail:
info@bpmmicro.com Web:
www.bpmmicro.com
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