Assembly packaging
environments. The launch of high impact initiatives in this area has to date been difficult due to both the complexity of the field and breadth of technologies that require further development. The problems of complexity also bring an added dimension in terms of the difficulty in achieving acceptable yield and reliability even with robust packaging technologies and hence motivating the inclusion of field of embedded test, fault tolerance and condition monitoring as core technologies without packaging and integration methodologies.
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the devices work correctly and to make sure the patients are safe.
Next wave electronics Another key area for packaging development is within the microsystems market. Microsystems packaging is a diverse and demanding technology where advances are needed to commercialise the next wave of micro & nanotechnology enabled products. In contrast to packaging technologies for silicon based electronics, the packaging solution for MNT enabled products will normally need to provide a physical interface to devices with feature sizes up to 9 orders of magnitude smaller, than the package itself and in many cases becomes part of the integration platform and associated functionality.
Implementations range from wafer level encapsulation involving novel bonding processes through to machined assemblies utilizing laser drilling and micromachining. Future applications include health, security and environmental systems where biology, optics and electronics must interact reliably through to aerospace and transport where micro-transducers and electronics must co-exist in high stress
Discussions between delegates at the event highlighted many key issues surrounding packaging in health and microsystems. Delegates highlighted gaps that needed bridging between all members of the supply chain. The main issue concerning sensors manufacturers was the lack of collaboration within the medical community, especially clinicians. Companies were also unsure of the requirements and specifications of the devices. It was agreed that the UK must be careful to not focus only on low costs products with high volumes, and to be smarter at developing flexible solutions, manufacturing and supply chains, to facilitate the lower volume but higher added value products that are usually less competitive in terms of low price. Funding was seen as key to enable a low cost/subsidised development of demonstrators that will encourage the supply chain to organise itself to supply these needs and prime the pump.
Conclusion
In conclusion, the sessions highlighted that delegates believe that good national facilities do exist, but must be further developed. There is a considerable lack of communication between all parts of the supply chain, as, albeit working in a similar space and on similar topics, neither is fully aware of how the opportunity to collaborate could connect the gaps they are struggling to fill.
Once these gaps have been identified and filled, we will start to see the commercial benefits of establishing an end-to-end supply chain, to enable UK technology innovators to get products to market faster and easier.
www.euroasiasemiconductor.com Issue IV 2010
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