Industry Networking
material. These areas are important for electric cars and for wind turbine generation.
Why Collaborate? EuroAsia Semiconductor then asked Jones, “Why? Why do companies share the knowledge?” Jones says that companies have patents on their important technologies, and that every company wants to show that it’s leading in certain fields. The goal is to prove that you have technology beyond other companies and that venues like SEMICON Europa allow companies to showcase their technology.
Jones says that the upcoming show has
numerous programs about wafer-level applications. He states that electronics are always moving and migrating to the east, but SEMICON Europa demonstrates that many new ideas and technologies are initiated in Europe. He says that “having new technologies is so important for Europe’s future— or Europe will be like a museum. We have great high-tech companies with a very high level of technology. Ideas may go into production elsewhere, but to have the hold on technology is critical.” Emphasizing that Henkel is a global
organization, Jones says that “We accept where materials are made and understand that we want them near the end customer. But we should design at headquarters because if you don’t, then you lose the technology and then eventually you lose the production as well. It’s important for us to have a strong presence, both R&D-wise and also material and manufacturing- wise, in each of the key spots of the world— North America. Europe, Asia. If you lose out at the technology front-end, then you can never “catch up.”
Packaging and materials are major issues in the semiconductor industry. The SEMICON Europa Advanced Packaging Technologies Conference is all about production and manufacturing, focusing on what is currently going on and addressing new materials and technologies that mature industrialization. Jones urges people in the industry to
become aware of what’s going on in Europe by attending the upcoming SEMICON Europa show. He says that the show is “an opportunity to learn about the development of materials to improve packaging and assembly with a focus on the really exciting areas for materials going forward. The agenda focuses on new applications showing the technologies that many
of our large companies in Europe have come up with.” Presentations on flexible packaging (relevant for eWLB) and materials for higher power applications will be featured. These topics and more will be covered at SEMICON Europa 2010. With a theme this year of “Enabling Packaging Technologies for System Integration,” the four sessions are: Packaging for Systems with CSR, Fraunhofer IZM, Elmos Advanced Packaging, Micro Materials Center; Alternative Device Packaging with Osram Opto, BridgeWave Communications, and NXP; Embedded Wafer-Level Packaging (Infineon, Nanium, Freescale); and Packaging and Materials with Bosch, Henkel, Oerlikon, and ASE.
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Wide range of materials (GaN, AlN, AlGaN, InN and InGaN) on different sizes and types of substrates (sapphire or SiC)
www.euroasiasemiconductor.com Issue IV 2010
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