IC Industry Award Winner Wafer Processing FEOL Award The PlasmaPro System400
The PlasmaPro System400 offers the flexibility of DC, RF and Pulsed DC reactive magnetron sputtering for batch or single- wafer PVD processing in production or research & development. Key features include: DC magnetron sputtering for metals, pulsed DC for high rate reactive sputtering using O2, N2 or H2, and RF magnetron sputtering for dielectrics. Multiple materials can be deposited in one chamber in a single process. The PlasmaPro System400 may be configured with up to 4 x 200mm magnetrons. Its single process chamber is divided into four sub chambers, isolating the sources from each other without the high cost of clustering several single process chambers. Multi-layer processes are completely automated by process recipes in the PC2000TM process tool software, with its intuitive graphical interface and flexible user options.
The PlasmaPro System400 provides the ability to sputter metals, oxides, nitrides and silicides with film thicknesses from 20nm up to several Ìm. It offers great flexibility in processes and materials, enabled by the wide temperature range of the wafer table, with both water cooling and heating options up to 300°C. The RF bias allows plasma-assisted deposition or wafer pre cleaning for greater adhesion and control of film structure and stoichiometry
PlasmaPro System400 provides optimum process stability The rotating shutter on magnetron sources allows source start-up and stabilisation before exposing the wafer to sputtering vapour. In addition its cross-contamination shield sub-divides the chamber, preventing wafer-to-wafer and target contamination.
The load-locked wafer entry minimises particle and target contamination, and an optional cryo pump or turbo pump/cryo panel for water vapour sensitive applications.
Optimum process uniformity The Wafer table may be operated in either static or rotating mode
Uniformity masks can be fitted to further enhance uniformity, or removed for higher-rate processes
The system offers fast, easy fitting and removal of the uniformity shields
Range of wafer handling options: Single-wafer load lock Cassette loading Clustered cassette-to-cassette via robotic wafer transfer
The system is based on the same hardware platform as Oxford Instruments’ PlasmaPro System100 and PlasmaPro System133 plasma etch and deposition tools, recognised for their reliability in hundreds of installed systems worldwide. The hinged chamber lid allows quick and easy access to the removable liners for cleaning with minimum downtime. Chamber liners are supplied as standard, with an option for additional liners. This enables fast change- over for regular cleaning routines and reduced particle contamination. The PlasmaPro System400 may be
clustered with other Oxford Instruments process tools, for both etch and deposition, including the PlasmaPro System100 etch and deposition tools, Ionfab300Plus ion beam etch and deposition tools, and the FlexAL ALD tool.
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www.euroasiasemiconductor.com Issue IV 2010
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