IC Industry Award Winner Wafer Processing BEOL Award
EVG770 Automated NIL Stepper
EVG’s next-generation UV-nanoimprint lithography (UV-NIL) step and repeat system features capabilities designed to address growing customer demands for improved pattern fidelity at ever-smaller feature densities, greater process reliability and increased accuracy.
The tool is designed for step and 18
repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers. The NIL Stepper covers applications like life science, optical components, mastering, 3D-Lithography and R&D for semiconductor devices. One of the main markets driving UV-NIL adoption is the micro-optics arena, which utilizes master lenses to develop working stamps for full- wafer lens micro-molding of CMOS image sensors for wafer-level cameras, among others. Augmenting traditional single-step processes, EVG’s step and repeat approach enables manufacturers to create a master that can then be replicated across the substrate to subsequently produce a full- wafer lens micro-mold. This approach offers significant yield and cost advantages compared to conventional mastering processes, such as micromachining techniques (e.g., diamond drilling), photoresist reflow, LIGA and e-beam writing.
Some of the key new features the EVG770 touts include vacuum imprinting on a spun-on polymer layer, which eliminates defect issues caused by trapped air bubbles—ultimately resulting in
superior pattern fidelity; optical sensors that align the stamp and wafer into perfect parallelism for contact-free wedge compensation; chuck movement via a non- contact bearing system to reduce particle contamination; high-precision alignment system with accuracy within +/-500 nm;
www.euroasiasemiconductor.com Issue IV 2010
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