Industry Networking
Technology transforming packaging
Another important conference at the SEMICON Europa will be the SEMI Advanced Packaging Conference. New packaging applications will change the face of semiconductor assembly. One example is eWLB (embedded Wafer-Level Ball Grid Array), which offers major advantages for future packaging requirements. Is this technology already commercialized or just experimental at this stage? Seeking answers, EuroAsia Semiconductor talked with Graham Jones from Henkel. Jones is on the organizing committee for the annual conference and shares with us some of the highlights of the conference and how the presentations will address today’s critical materials issues in manufacturing.
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he conference aim is to look at the technology that will transform
packaging for the industry. A key member of the organising committee has been Graham Jones from Henkel who has a long history with this aspect of the value chain. Jones says that several companies that are looking into eWLB for applications of small die sensors, including ST, Bosch, and Fraunhofer. While these companies all have major initiatives in this area, eWLB is primarily commercialized by one key company, Infineon.
In October at SEMICON Europa, Edward
Fürgut from Infineon will present on “eWLB Reconstitution - From Idea to Volume Production.” Fürgut is involved in wafer-level packaging development and he’s one of the key researchers driving the highly successful embedded wafer-level package that Infineon first released to production in 2008. He holds more than 20 patents in the field of assembly and packaging. Fürgut says that microelectronic packaging is tough especially because increasing interconnect density will cause major problems, requiring an ever-closer merging of chip and package technologies. He will show that eWLB offers impressive advantages for future packaging requirements. Another presentation, “Polymeric Alternatives to Solder Die Attach for Power
Assemblies,” by Dr. Gunther Dreezen (Henkel Electronic Adhesives) will address a polymeric alternative to soldering. High melting point alloys, typically containing Lead, are used as a die attach material in power assemblies, but Dreezen will talk about the development of a polymeric alternative to soldering, which Henkels views as a technically and commercially viable alternative assembly method for medium- and high-power semiconductor devices. Jones talks about Henkel’s drive for “material for higher power.” He says “as things get smaller and smaller, there’s more heat generated so you need to be more efficient, particularly in mobile communications. You need materials that don’t have a leakage current. If you have leakage, then your battery time runs down much faster than if you’re more efficient.” Henkel is also focusing on powering cars, especially hybrid cars. Jones says that developing new materials that have very high thermal and electrical properties for these devices to function is currently a focus, and that the Henkel presentations at Europa will demonstrate materials that go far beyond what we see today in normal epoxy-type product and normal solders. An example is IGPT (integrated gate bipolar transistors), an area where it’s absolutely vital to have extremely high electrical and thermal properties for the die attach
www.euroasiasemiconductor.com Issue IV 2010
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