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Assembly packaging


Packaging for 20


the future Packaging of modern IC’s and nano sized devices are costing more of the overall cost than ever before. Manufacturers are always on the look out for the best alternatives but it takes industry wide efforts to understand and achieve the changing needs of the industry. UK based, Nanotechnology Knowledge Transfer Network NanoKTN discusses some challenges and industry based directions that have unfolded.


P


applications are functional combinations of two or more device technologies.


Specialist packages


Packaging is central to the integration of new and novel fabricated devices and the development of specialised packaging is essential to enable greater functionality, efficiency and security in high value product design. To meet some of these needs, a number of manufacturers have developed a variety of forms of “Air Cavity Package” suited to prototyping, production and standard package styles. However, the range of NEMS applications now being developed is seeing the need for more specialised, application specific package options.


In the last 12 months, the established IC markets have been growing rapidly and there has been a significant surge in the emerging technology area of packaging and micro and nano-enabled sensors. These technologies have offered a great opportunity for those who have been able to adapt their systems, processes and materials.


Earlier this year, the NanoKTN held a joint


ackaging of Electronic Devices & Nano Systems has become one of the more challenging aspects facing designers and developers of new technology, due to the needs for freedom of movement of the many elements found in modern applications. Most Nanoelectromechanical Systems (NEMS) manufacturers would claim a minimum of 40% up to 80% of the cost of devices can now relate to packaging needs. The presence of NEMS is crucial in many


high value product markets, but their development presents challenges. NEMS systems often require packaging for environmental protection and for interconnection. While there are a wide range of NEMS devices, a common need is for packaging that allows movement of the internal device during operation, either a cavity type of package or a cavity lid bonded over the NEMS structure. Many sensors need to sense their environment to function as opposed to being isolated in a solid block of material and many devices or


Electronic Devices & Nano Systems focus group and Micro & NanoSensor Interest Group (MiNSiG) event at the Rutherford Appleton Laboratory (RAL). The organising committee was composed of the NanoKTN, JEMI and the Sensors & Instrumentation KTN, and hosted by the Science & Technology Facilities Council at the Rutherford Appleton Laboratory. The event was held to examine the area of Packaging NEMS and NEMS, and aims to highlight and evaluate by discussion, the supply chain issues for the nanotechnology sector supplying products into the nano-electronics, NEMS and other related emerging hi-tech sectors such as healthcare. This event saw presentations from key players in the industry, including BAE Systems (military applications), Toumaz (body area networks), Optocap (packaging solutions) and PandA Europe.


www.euroasiasemiconductor.com  Issue IV 2010


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