Developments in temperature sensing technology continue to enable disruptive Technology applications


review


Figure 1 shows how it would be used in a typical application, and it can be used to replace conventional precision RTDs, NTCs or thermistors in a range of applications including industrial control and HVAC.


For applications that require contactless temperature sensing, TE Connectivity has also developed the TSEV01S01C10, a complete and compact system that uses an infrared sensor to measure the temperature of an object without making contact. It is able to provide temperature measurements between 0°C and 300°C with an accuracy of 2°C, while the module can operate in an environment of between -10°C and +85°C. The fi eld of view (FOV) of the sensor (Figure 2) is focused using a heat spreader in order to deliver the highest accuracy.


The sensor integrates a thermopile with signal processing, non-volatile memory and a SPI interface (Figure 3). The sensor detects energy in the infrared region, which is converted into an analogue voltage. The device is able to provide both the ambient temperature and the temperature of the object in the sensor’s FOV. All data is accessed through the SPI bus interface.


+3.0V VDD DCI3000 VDD 100nF SDA


Microcontroller I2


GND SCL 10k 10k Interface C- SDA SCL


Figure 1: The TSYS02D can be used to replace precision RTDs, NTCs or thermistors in a range of applications. (Source: TE Connectivity)


The information gleaned from measuring and monitoring temperature goes far beyond the apparent; change happens for a reason and we are increasingly able to extrapolate that reason from the simplest of data. As the availability and accuracy of temperature sensors continues to increase it will help expand our knowledge and enable even greater levels of control.


Find out more about Braster at avnet-abacus.eu/braster-case-study


8 +3.0V VDD


100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0


-15-14-13-12-11-10-9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Angle / °


Figure 2: The TSEV01S01C10 uses a heat spreader to focus the fi eld of view, in order to deliver high accuracy across a wide temperature range. (Source: TE Connectivity)


EEPROM


Thermopile MCU


(Signal Processing, Signal Compensation)


Interface SPI


Figure 3: This block diagram of the TSEV01S01C10 shows how easily it can be integrated into any system, to provide accurate temperature measurement with the convenience of being contactless. (Source: TE Connectivity)


Summary


Research is constantly being carried out to develop new methods and materials for temperature sensing, particularly in ways specifi c to an application, as demonstrated by the Braster system. Few would naturally reconcile temperature sensing with cancer screening but it is exactly these kinds of applications that inspire others to develop equally disruptive technologies.


Thermopile Signal / %


FOV


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34