Interview
What are your organisation’s sensor capabilities?
TE has one of the broadest ranges of technologies and processes for sensing. We have a vast portfolio of established and novel core technologies combined with solid process know-how and packaging capabilities. Not only that, we have the ability to leverage the sensing core with strong analogue and digital electronic signal processing capabilities to enhance sensor performance and cope with the most severe environments.
In-house ASIC and MEMs design capabilities allow us to tailor products at market-leading price points to a wide variety of end-use applications. Our decades of experience in deploying sensing in the harshest of environments – including deep sea, aerospace, automotive, nuclear and military – give us unparalleled packaging know-how across multiple markets.
Our products cover a huge range of sensor types, including pressure, temperature, force, humidity, position and motion. To achieve this we employ a variety of core sensing elements such as piezoresistive materials, thermocouple alloys and MEMS structures. And we have technologies that extend to non- contact sensing such as thermopile, optical and ultrasound. Thanks to our experience in connectors, we provide the expertise required to communicate reliably what is being measured to the rest of the system through cable exits and assemblies. TE also supports a range of wireless solutions for IoT.
What are the top three trends you see in sensors today?
The fi rst key trend is miniaturisation. Sensors are proliferating across countless applications as we move to an increasingly connected world. Many of those applications require multiple sensors in a small footprint with no degradation of performance.
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