Interview
The future of sensor technology with TE Connectivity
“Our customer’s customer is moving faster than before. So they need support to get it right the fi rst time and reduce development cycles. They need to make it smaller, better and able to cope with severe environments.”
This is pushing sensors to become ever smaller – and often with very low power requirements.
The second is digitisation. With so many applications playing in the IoT space, the shift to digital is required for intelligent sensors that not only capture sensing data, but also interpret that data for a variety of applications.
Sensor fusion represents the third major trend. As with the trend towards digitisation, multi-sensor integration is directly related to IoT proliferation and the expectation that everything is connected. The need to capture multiple types of measurement in extremely small packages is pushing the development of multi-sensing elements. These three trends often
overlap along with a need for higher performance at lower costs.
Tell us about the meaning of sensor fusion and its implications?
Historically, many pressure transducers could be supplied with temperature-sensing options. Now, many of our sensors include temperature at a minimum and we see the need to add other types of sensor. We now have tri- and quad-sensor designs that reduce cost and complexity for our customers. The breadth of our product range coupled with our application expertise allows us to leverage our portfolio to overcome design obstacles and drive real innovation in sensor fusion.
Pressure sensors
Temperature sensors
Position sensors 14
Humidity sensors
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