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THERMALLY CONDUCTIVE | TECHNOLOGY


integration potential of plastics can be combined with effective heat dissipation and homogeneous temperature distribution,” he explains. According to Sebö, there are many new potential application areas that use high energy density electrical components – such as processors, light emitting diodes, electric motors, batteries and electronics – where efficient heat dissipation is required while maintaining electrical insulation. Integration of heat management/heat sinks into housings or enclosures, for example.


Processing considerations “In addition, other considerations include processing or the targeted thermal conductivity of different additives and inorganic fillers, depending on the mechanical requirements,” he says. “Independent of what kind of filler or additive is used to increase the thermal conductivity of the polymer, the main function must be adhered to. This means the higher the fill; the better the thermal conductivity. However, this will influence other material properties, such as mechanical. Processing is also influenced with an increased degree of filling. Furthermore, filler properties have to be


considered in terms of density, hardness, grain size, colour, morphology and obviously price.” HPF The Mineral Engineers introduced its


Silatherm product range in 2013. The company says that the fillers provide well balanced properties in a variety of polymer systems, including thermoplastics, thermosets and elastomers. The range can provide colourable solutions that offer good electrical insulation. Grain size can be optimised with bi- or tri-modular grain size distribution while surface treatment technology


Above: Thermal


management is a key requirement in batteries for electric vehicles


INVENTIVE COMPOUNDING Next Level Performance


STRUKTOL Innovative Additives are designed to help you enhance compound processing.


Visit us at booth A328 Cleveland, Ohio, USA / May 8-9, 2019


Learn more at 4struktol.com or email plastics@struktol.com


PHOTO: SHUTTERSTOCK


Viscosity Reduction


Improved Mold or Die Release


Enhanced Fi l ler Dispersion


Faster Throughput Rates


great IDEAS are born he re !


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