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www.us-tech.com


September 2023 ElEctronic Mfg Products from Micro Control


High-Power Burn-In System


MINNEAPOLIS, MN — Micro Control Company announces the release of the HPB-6 high-power logic burn-in with test system. The HPB-6 is Micro Control Com- pany’s most advanced, high-per- formance burn-in with test system capable of performing dynamic burn-in with test on extremely high-power devices up to 1,000W. Featuring individual temper-


ature control (ITC) for each device under test for up to 12 devices per burn-in board, the HPB-6 keeps devices at an optimal temperature for stressing and testing during a burn-in cycle. Water-cooled, high- force heatsinks provide excellent thermal contact for efficient heat transfer. Programmable power sup-


plies provide up to 4,400W of reg- ulated power to each burn-in board. With 24 high-current and 24 low-current supplies per burn- in board, a wide range of individ- ual supplies for miscellaneous support circuitry is available. With 128 digital I/O and 128


drive-only signals to each burn- in board, the HPB-6 can exercise and test high pin count devices or test many devices in parallel. Its 128M words of vector memory


TRI Launches High-Performance 3D SPI System


SAN JOSE, CA — Test Research, Inc., has introduced its TR7007Q SII, a state-of-the-art 3D SPI sys- tem designed to maximize produc- tion efficiency. With its high-speed platform, the TR7007Q SII deliv- ers up to 50% faster inspection compared to previous models, en- suring manufacturers achieve un- paralleled performance. The TR7007Q SII is equipped


HPB-6 burn-in with test system.


allow it to run large numbers of test vectors without time-con- suming reloads. Micro Control Company is an


industry leader in high-power burn-in systems with individual


temperature control (ITC). Contact: Micro Control


Company, 7956 Main Street NE,


Minneapolis, MN 55432 % 763-277-9217 E-mail: l.ottray@microcontrol.com Web: www.microcontrol.com


with a 9.8 µm high-resolution 21 MP camera, delivering enhanced measurement accuracy and stabil- ity, ideal for diverse industries. The 3D SPI’s versatility ensures reliable and precise results. The TR7007Q SII can also effectively inspect bumps, flux, mini LED solder, and bare boards. The 3D SPI’s improved accu-


racy and stability enable precise solder measurements and mini- mize false calls, guaranteeing reli- able inspection results. Equipped with a wide spectrum light system and coaxial lighting, the TR7007Q SII provides higher contrast, ex- ceptional clarity, and uniformity


8:30:23 AM


significantly improving the detec- tion rates. Smart 3D SPI solutions ease


data exchange between the pro- duction line and the MES of the


TR7007Q SII 3D SPI system.


customer’s choice to enable data traceability for the connected factory. TRI’s SPI platforms sup- port IPC-Hermes-9852, IPC-


CFX, and IPC-DPMX. Contact: Test Research


USA, Inc., 832 Jury Court,


Suite 4, San Jose, CA 95112 % 408-567-9898 E-mail: triusa@tri.com.tw Web: www.tri.com.tw


WESTBOND’s New 7KF


MEET THE


FUTURE OF TEST HANDLING


THE M12 IS OUR MOST COMPREHENSIVE TEST HANDLER TO DATE


• Up to 12 test boxes • Two-phase testing capability


• Patented vertical handling system • Minimal footprint, maximum capacity


DEFINES AUTOMATION. DEFIES EXPECTATION.


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sales@jotautomation.com • jotautomation.com See at The Battery Show, Booth 2157 


www.westbond.com


 


 





 


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