September 2023 Continued from previous page
boards are complex, accommodat- ing large pin-counts, high paral- lelism, and fast scan clock rates. Printed circuit boards often have many layers, including those for signal, power, and ground, and are carefully designed to maintain signal integrity while meeting me- chanical, power, and thermal re- quirements. In addition to the PCB de-
signs, brand specific sockets and connectors, unique stiffeners, high-speed digital I/O intercon- nects, or high voltage require- ments can further differentiate a loadboard’s design. For the end- user, a true plug-and-play solu- tion stems from a knowledgeable designer and a vast database of tester and handler specifications. Due to the high-complexity and batch production nature of these assemblies, unique manufactur- ing configurations and capabili- ties are needed to deliver reliable products, on schedule. The demand in the semicon-
ductor device testing market is driven by competing forces such as the volatile global demand for ICs and rapidly evolving tech- nologies. With an unpredictable market, it can be advantageous to partner with an EMS provider that emphasizes rapid prototyp- ing and batch production to pro- vide the flexibility to meet inter- mittent production schedules and short lead times. Naprotek has been an im-
portant manufacturing partner for DTS for both new product in- troduction (NPI) and repeat or- ders. With factories purpose- built for the batch production of complex electronic assemblies, Naprotek excels in high-mix, low-volume builds that require real-time production feedback, flexible sourcing models, and adaptable production schedules. Part of Naprotek’s adapta-
tion for batch production is the use of agile manufacturing tech- niques. The speed and agility of agile manufacturing come from highly trained staff, thoughtfully designed process control sys- tems, and flexibility in produc- tion capacity. This methodology includes cell-based manufactur- ing, which emphasizes one-piece production flow instead of batch- and-queue, which means that the production line is designed so assemblies are produced “first in, first out.” Operators are cross trained to manage workflows that operate continuously across several processes and not at a single station or machine. Due to the continuous nature
of production, Naprotek employs additional inspection over conven- tional manufacturing, typically following every transformation process. This practice has the ben- efit of increasing final yield and ensuring system reliability by catching process errors or defects
early in the assembly workflow. These inspection processes in- clude manual and automatic opti- cal inspection, flying probe, in-cir- cuit test, and X-ray.
Addressing the Need The only constant in the
world is change and that princi- ple holds as true for semiconduc- tor devices as it does for any- thing else. Through new technol- ogy advancements and trends like cloud computing, artificial intelligence, and high-perform- ance mobile, Moore’s Law is still
giving manufacturers challenges to overcome. So long as semiconductor de-
vices continue to become denser, faster, and more complex so too will tester interface boards. Naprotek is staying at the lead- ing edge of electronics assembly by continuing to invest in state- of-the-art surface mount technol- ogy process equipment, micro- electronics, RF technologies, and highly skilled engineering and manufacturing experts. Contact: Naprotek, Inc., 90
Semiconductor tester loadboard.
Rose Orchard Way, San Jose, CA 95134 % 408-830-5002 E-mail:
lmorrissey@naprotek.com Web:
www.naprotek.com r
www.us-tech.com Naprotek, Dynamic Test Solutions and Moore’s Law
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