October, 2023


AMHERST, NH — Finetech has sold a FINEPLACER® pico 2 to AmTECH Microelectronics, a Silicon Valley provider of ad - vanced microelectronics assem- bly and packaging services. The purchase of the FINE-


PLACER pico 2 will advance AmTECH’s flip chip bonding and precision die bonding manufac- turing services. Designed to deliver high placement accuracy for an array of processes: flip chip bonding, precision die bond- ing, wafer level packaging, 2.5D and 3D IC stacking, chip-on- board (COB), chip-on-flex (COF), chip-on-glass (COG); in addition to a wide range of other assem- bly technologies. The new FINEPLACER pico


2 system delivers several fea- tures that will further benefit AmTECH’s customers seeking flip chip and die bonding with precision placement accuracy requirements in optical, medical and biotech, defense and aero- space, automotive and LiDAR, RF/microwave/mmWave, and other market applications. The FINEPLACER pico 2 supports all typical bonding technologies such as soldering/eutectic/sinter- ing die bond, adhesive bonding, flip chip thermocompression and ultrasonic bonding, as well as process forming gas, epoxy dis- pensing and UV curing. Combining micron place-


ment accuracy with a 13.8 x 6.1 in. (350 x 155 mm) large work


TAGARNO Unveils Digital


Microscope TUCKER, GA — TAGARNO has released a digital microscope fea- turing a 4K camera with an unprecedented 60 frames per second. The groundbreaking innovation will be officially unveiled at productronica 2023. TAGARNO’s latest offering


is a result of a collaboration with SONY, utilizing their cutting- edge 4K Sony FCB-ER9500 model. While there are digital microscopes with 4K resolution already available on the market, they typically operate at a frame rate of 30 frames per second. This limitation causes a notice- able lag between the actual microscope view and what is dis- played on the monitor, leading to discomfort and reduced efficien-


cy for users. Contact: TAGARNO, 5126


South Atlanta Drive, Tucker, GA 30084 % 678-978-3718 E-mail: mail@tagarno.com Web: www.tagarno.com


See at productronica, Hall A1 Booth 160


See at productronica, Hall A2 Booth 205


www.us - tech.com AmTECH Purchases Finetech Die Bonderpackaging


area, component sizes up to 3.9 x 3.9 in. (100 x 100 mm) and a wide range of controlled bonding forces up to 500N; the FINE- PLACER pico 2 system features a modular design for valuable


flexibility. “I am so pleased that


AmTECH has chosen our tech- nology to deliver the flexibility needed in high accuracy bonding applications for a very diverse customer base. Whether it is het- erogeneous integrated assem- blies or traditional single die to substrate bonding, the pico 2 will address them all. We look for- ward to supporting AmTECH in meeting their customers’ chal- lenges.” stated Neil O’Brien, gen- eral manager, Finetech. “The FINEPLACER Pico 2 is


FINEPLACER pico 2 die bonder.


the perfect addition to our other microelectronics assembly and


Page 77 equipment and


extends our extreme placement accuracy and control to the next level,” said David Walter Chavez, operations manager, AmTECH. “We are excited about the addi- tional capability and capacity we now have available to support our customer’s flip chip and die bond


high accuracy placement needs.” Contact: Finetech, 60 State


Route 101A, Amherst, NH 03031 % 603-627-8989


E-mail: kes@finetechusa.com Web: www.finetechusa.com


See at SMTAI, Booth 1435, and at productronica, Hall A4 Booth 181


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