search.noResults

search.searching

saml.title
dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
October, 2023


www.us-tech.com Openair-Plasma: Versatile and Reliable Continued from page 59


already mounted components. There are also applications in pre-stage


processes, such as the AntiCorr® corrosion protection coating. By applying this coating to silver-plated or copper-plated LED lead frames, they are protected and corrosion is prevented. Before the introduction of this PlasmaPlus coating, LED manufacturers had to use nickel-gold, gold or nickel-gold- palladium coated lead frames. These surface coatings are no longer necessary due to plas- ma processing and can reduce both manufac- turing costs and production time.


More Applications Another application process


in the LED field is the prevention of epoxy bleeding. The bleeding of epoxy resins from the adhesives used is a phenomenon well-known in the industry. The bleeding sub- stance is often clear and colorless and surrounds the attach. The epoxy bleedout has a neg-


ative effect on the following steps in LED manufacturing, such as wirebonding. Typically, bleeding epoxy is removed in a vacuum plasma process. However, this process step can be avoided since barrier coating applied in advance using Openair-Plasma will pre- vent the bleeding. Even MSDs (moisture sensi-


tive devices) can be pretreated with Openair-Plasma to save costs for electronics manufactur- ers. Special handling or storage is no longer necessary, leading to cost reductions. With a Plasma - Plus coating in the production process, these components can be classified in a lower MSL (mois- ture sensitive level) classifica- tion. The ability for component manufacturers to bring their components to lower MSL offers great added value, as some elec- tronics manufacturers require that only components up to a cer- tain MSL can be used. Openair-Plasma has proven


its effectiveness in electronics manufacturing because the treat- ment of individual areas can replace processes such as surface cleaning with chemical cleaning media in a cost-efficient way. It offers almost unlimited possibili- ties for safe and reproducible


Get your


NEW 2024 Media Kit


For advertising opportuni- ties and editorial guidelines for contributed articles


Go to www.us-tech.com or call 610-783-6100


Metals Waste Recycling That Pays You Back! Joining with Conecsus Metals Me Joining with Conecsus Metals Mexico SA de C a Division of Conecsus L o SA de CV,, a Division of Conecsus LLC


processes. The results are high-quality sur- faces and materials with specific properties for innovative products and technologies of tomorrow. Plasma systems can be integrated into


existing production lines both inline and as a standalone solution, with a concomitant reduction in environmentally harmful prod- ucts such as chemical cleaning agents. Contact: Plasmatreat, 2541 Technology


By using Openair-Plasma there is no delamination on the PCB.


Drive, Suite 407, Elgin, IL 60124 % 847-783-0622 E-mail: mary.battiste@plasmatreat.com Web: www.plasmatreat.com r


See at productronica, Hall A2 Booth 445


Page 63


At Conecsus, we’re dedicated to environmentally responsible recycling and high real yield recovery of Tin, Lead, Silver from SMT/PCB Metallic reclaim forms including dross,solids, paste, and more.


We are one of the largest non-ferrous secondary Tin and Tin/ Lead based alloy recyclers in the world, and we operate the largest rotary furnace in the western hemisphere.


We pay on pounds received through the door, not just on recovery, and we pay on time. Learn more; visit www.conecsusllc.com today!


Conecsus U.S. Tel. +1 (972) 551-5900 Conecsus Metals Mexico +52 664 331 4239


See at SMTA Guadalajara, Booth 1706


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100