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www.us-tech.com
Low-Temperature BGA Solder Spheres from SHENMAO Raise Yield Rates
SAN JOSE, CA — SHENMAO America is now offering low-tem- perature solder (LTS) materials, specially engineered to reduce reflow temperatures. SHEN- MAO’s LTS materials mitigate PCB and substrate deformation, save energy, reduce the thermal stability requirements of sub- strates and components, and ul- timately enhance yield rates. One of the standout offer-
ings in this lineup is the PF734- S low-temperature BGA solder
sphere, meticulously designed for low-temperature ball attach- ment processes. PF734-S is per- fectly complemented by SHEN- MAO’s low-temperature no-clean flux SMF-80 and water-soluble flux SMF-WC63, each tailored to meet the unique requirements of different customers. PF734-S, built upon an im-
proved low-temperature alloy PF734, outperforms convention- al low-temperature alloys like 42 percent Sn and 58 percent Bi. Its
mechanical properties have been significantly enhanced, ensuring exceptional product reliability even under rigorous testing con- ditions such as thermal cycling and thermal shock tests. SHENMAO’s low-tempera-
ture flux solutions, SMF-80 and SMF-WC63, deliver excellent workability and are formulated with special activators that opti- mize wettability and solderabili- ty. As a result, manufacturers can achieve superior ball attach-
ment yield rates. Contact: SHENMAO Ameri- ca, Inc., 2156 Ringwood Avenue,
San Jose, CA 95131 % 408-943-1755 E-mail:
usa@shenmao.com Web:
www.shenmao.com
Surfx Demos Flux-Free Wafer Cleaning
REDONDO BEACH, CA — Surfx Technologies is focusing on its flux-free flip chip and hybrid wafer bonding technologies, at produc- tronica, showcasing its commit- ment to advancing semiconductor manufacturing pro cesses.
October, 2023
STA-10iL wafer cleaning system.
Two distinguished manufac-
turer representatives will repre- sent Surfx Technologies, provid- ing attendees with valuable in- sights into the company’s cut- ting-edge solutions. At the booth of Novel-Tech-
nology Transfer GmbH attendees can witness Surfx Technologies’ flagship product, the STA-10iL machine, in action. This state-of- the-art machine is configured for cleaning and oxide removal from 11.8 in. (300 mm) wafers. Live demonstrations will
highlight the effectiveness of the STA-10iL machine in providing flux-free cleaning solutions for semiconductor wafers. Surfx’s unique technology ensures a pristine wafer surface, essential for achieving high-yield and high-performance semiconductor devices. In addition to the live
demonstrations, a video reel will be presented, showcasing the STW wafer cleaning tool and various atmospheric argon plas- ma cleaning applications tailored
to the semiconductor industry. Contact: Surfx Technolo-
gies, LLC, 26831 Manhattan Beach Boulevard, Redondo
Beach, CA 90278 % 310-558-0770 E-mail:
sales@surfxtechnologies.com Web:
www.surfxtechnologies.com
See at productronica, Hall A3 Booth 120
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