October, 2023
www.us-tech.com
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Hyrel Technologies Precision Semiconductor Modification Continued from previous page
high-performance interconnecting materials and related services for the electronic and micro-component assembly markets. The company’s BGA component re-
balling services are suitable for conversion to tin-lead, RoHS compliance, ball attach to LGA, QFN, and DFN packages, ball pitch from 0.40 mm, processing of ceramic and plastic BGAs and LGAs, LGA gold removal and reballing, and conversion to leaded spheres for high-reliability applications.
l Robotic Hot Solder Component Tinning. Hyrel Technologies is a pioneer in the robotic hot solder component tinning process. Through continuous process improvements, the company now offers a world- class “touchless” process, effec- tively removing tin dendrites and replacing solder alloys as needed for high component reliability re- quirements. Leveraging industry- leading robotic solutions, Hyrel surpasses competitors with un- paralleled precision and repeat- able quality in the market of com- ponent reliability modifications. Robotic hot solder component
tinning has common applications in ROHS compliance, restoration of solderability, tin dendrite re- moval, and component reuse. Watson said that the company ad- heres to GEIA-STD-0006, ANSI- J-STD-002, MIL-STD-202, and MIL-STD-883 standards in order to ensure the highest level of qual- ity and compliance.
l Lead Form and Trimming Services. Hyrel also provides mil-spec precision lead forming services, further enhancing its comprehensive offerings.
l Component Taping and Pack- aging Services. The company’s manual and automated taping systems adhere to industry stan- dards EIA-481-E, providing flexi- ble, reliable, and swift services. With the incorporation of auto- mated tape forming processes and a diverse inventory of taped pockets, including hard-to-find component pockets, it seamlessly supports various component package types. These include sur- face mount pockets, inside paper tape spacing for capacitors, punched paper tape for leads, and custom thermoformed trays. In all tape-and-reel or pack-
aging projects, Hyrel’s expert team selects appropriate materi- als to prevent loading/unloading issues and electrostatic discharge (ESD) failures in sensitive elec- tronic parts. Hyrel Technologies also fea-
tures an extensive list of capabil- ities that includes surface mount spheres, tray/tube bake, trays/ tubes/waffle packs, heat seal or PSA, component de-tape, auto- mated placement, standard/cus- tomizable bar coding, and capaci- tance/resistance testing.
CM and NPI The company also offers con-
tract manufacturing (CM) and new product introduction (NPI)
See at SMTAI, Booth 1221 and productronica, Hall A4 Booth 318
builds, using both automated and manual techniques for placing printed circuit board components. This capability allows Hyrel to meet the most rigorous and specialized design requirements in industries such as aerospace and defense, medical, industrial, LED lighting, and non-commodity consumer electronic prod- ucts. Moreover, Hyrel Technologies specializes in quick-turn NPI and prototyping services, further cementing its position as a leader in semiconductor modification solutions. Hyrel Technologies stands as a global
powerhouse in providing precision semicon- ductor modification solutions. Armed with a diverse range of services, advanced technolo- gy, and a highly skilled team, the company
The Hyrel Technologies team. Continued on page 25
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