PRODUCTS EDITOR’S CHOICE THE ULTRAMINIATURE PHOTOMOS RELAY
operating power, and the transfer characteristics are concerned. For example, the new relays can be used in ambient temperatures of up to 105°C. The forward current needed for activation is typically as low as 0.2mA, and the
I
n contrast with Panasonics’ PhotoMOS relays, the galvanic
isolation of input and output of the company’s TSON relays is not optical, but capacitive. Apart from the notably smaller footprint, the TSON relay offers significant advantages as far as the temperature range, the nominal
input can be driven with a typical voltage of 3.5V. A resistor as required for PhotoMOS is no longer necessary. The turn-on time for this relay
is (depending on the type) within the range of a few 100µs. In spite of the very small size of as tiny as 1.8 by 1.95 by 0.8mm (LxWxH),
the galvanic isolation between input and output is 200V AC. The new package brings space savings of more than 50% compared to the previously smallest package types SON & VSSOP. These new devices are available
for load voltages from 30V to 60V. Depending on the type, the Low CxR may be as low as 10pFxOhm. Particularly in the areas of IC and board testers, medical technology and multipoint recording, the new capacitive coupled PhotoMOS relays in TSON packages make advances in circuit-board design possible that were never before even dreamed of.
panasonic-electric-works.co.uk
NEW 48 V BUCK REGULATORS
Vicor Corporation has introduced its latest high efficiency PI3542, PI3543, PI3545, and PI3546 buck regulators. The new devices enable 48V direct to PoL high performance step-down regulation. The Zero-Voltage Switching (ZVS)
topology provides efficiency over 96% with the high density 10 by 10 by 2.5mm LGA System in Package (SiP) module for power delivery over 100W. The regulators integrate a high
KEYSIGHT ADDRESS EMERGING 4G TEST CHALLENGES
Keysight Technologies, Inc. has announced new enhancements to its E7515A UXM wireless test set to address leading-edge LTE-A carrier aggregation (CA) test requirements. The company advises new capabilities include support for downlink 4CC1, 256 QAM, and LTE-U with up to three unlicensed carriers, as well as FDD-TDD mixed CA and uplink intra- and inter-band CA measurements. The UXM’s large touch screen display and intuitive user interface provide easy access to complex network emulation and bring a wealth of functional test capability in an accessible stack-based environment, including support for the new 3GPP category 0 for low power, low cost machine-to-machine (M2M) devices. Also new to the UXM is the addition of W-CDMA/HSPA+ test capabilities, enabling 3G data throughput
testing with integrated fading and CPC statistics, inter-RAT mobility and handover verification, and time- aligned multi-format logging. These latest enhancements enable LTE/W-CDMA inter-RAT cell reselection, connected data handovers,
and release with redirect in a single UXM test set, including support for CSFB and SRVCC. Validation engineers can also connect two of these instruments in an array to test mobility between up to four LTE cells, and handover between LTE-A multi-carrier and W-CDMA/HSPA+ connections. The company highlights that this solution is a highly integrated signalling test set created for functional and RF design validation in the 4G era and beyond. It is claimed to deliver LTE-Advanced data rates up to 600Mbps now and handling more complex requirements later. Users can assess design readiness with greater confidence with the UXM.
Keysight Technologies, Inc.
www.keysight.com
performance ZVS topology that enables 48V direct to PoL without sacrificing performance. With step-down regulation from a higher voltage source, engineers can deploy more efficient power distribution architectures, reduce I2R losses, and eliminate costly and inefficient intermediate conversion stages.
www.vicorpower.com
Altium has released a new extension for its flagship PCB design tool, Altium Designer. MCAD Co-Designer. SOLIDWORKS helps to facilitate collaboration between mechanical and electronic design teams with integrated design data, a managed change environment for design revisions, and lifecycle management for component creation, among other features. This extension is available now to purchase for all current and prospective Altium Designer customers.
www.altium.com
RS ADDS PROFESSIONAL-GRADE 3D PRINTER SYSTEM
RS Components has added the EnvisionTEC Perfactory Micro XL personal desktop 3D DLP manufacturing system to its existing product portfolio. This system delivers high- resolution print capability within a compact desktop form factor, and plugs easily into a PC via a standard USB connection. It is compatible with proprietary flexible ABS compounds as well as HTM 140, which is ideal for tooling inserts. With a build envelope of 100mm by 75mm by 100mm, it can tackle a
6 JUNE 2015 | ELECTRONICS
wide range of industrial and commercial tasks. XY resolution of 150µm and dynamic Z resolution of 50-100µm allow users to build accurate and finely detailed reproductions of objects that have been scanned, computer generated or downloaded from the Internet. “3D printing is developing quickly and has countless industrial applications, like prototyping electronic enclosures or quickly replicating small components. RS is dedicated to offering the best selection of equipment meeting the needs of our customer base,” said Ben Lawton, Global Head of Tools and
Consumables at RS. “Perfactory Micro XL delivers a revolutionary combination of high print performance and affordability for a printer in this class, from a brand that is already established as the first choice of the jewellery design industry and rapid prototyping houses.” Martin Forth, VP of European Sales
for EnvisionTEC said: “This valuable alliance allows us to efficiently meet the market demand for EnvisionTEC’s solution-based products globally.” RS Components
www.rs-online.com
/ ELECTRONICS
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